zicm0868p0 California Eastern Laboratories, zicm0868p0 Datasheet
zicm0868p0
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zicm0868p0 Summary of contents
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... Document No: 0009-00-07-00-000 (Issue ES) Date Published: April 5, 2011 PRELIMINARY DATA SHEET MeshConnect™ Sub-G Module Series 868 / 900 MHz System-on-Chip (SoC) Based Modules ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1 MeshConnect ZICM0868P0 • Long Range • Low Power Consumption • 868 and 900 MHz Frequency Ranges • ...
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... ZICM0900P2-1C MeshConnect™ ZICM0900P2-1CU-SN Sub-G Module (902-928 MHz) ZICM0900P2-1CS-SN ZICM0900P2-1C-SN ZICM0868P0-KIT1-1 MeshConnect™ Sub-G Development Kits ZICM0900P2-KIT1-1 MeshConnect™ Sub-G Module Series Description 868 MHz Module, +13dBm SoC with U.FL connector for external antenna 868 MHz Module, +13dBm SoC with RP-SMA connector for external antenna 868 MHz Module, +13dBm SoC with 1/4 wave wire antenna 900 MHz Module, +20dBm SoC with U ...
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... For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL’s website: www.cel.com/MeshConnect) DEVELOPMENT KIT ORDERING INFORMATION Part Number Order Number ZICM0868P0-KIT1-1 MeshConnect™ Sub-G Development Kits ZICM0900P2-KIT1-1 MeshConnect™ Sub-G Module Series ANT MeshConnect ...
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TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Antenna................................................................................................................................................................................................... Additional Flash Memory....................................................................................................................................................................... Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. ...
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TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 wireless SoCs ICs. These devices incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance ...
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... MeshConnect™ Sub-G Module Min Typ Max 1.8/2.7* 3.3 3.6 865 – 870 902 – 928 - 3.6V, ZICM0868P0 TX power max) DD MeshConnect™ Sub-G Module Min Typ Max – 42 – – 24 – – 1.2 – = 3.6V, ZCM0900P2 TX power max) DD MeshConnect™ Sub-G Module Min ...
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... RF Frequency Range Transmitter Maximum Output Power Minimum Output Power FSK Error Deviation Receiver Sensitivity (1% PER, 150kbps) Sensitivity (1% PER, 2kbps) Saturation (maximum input level) MeshConnect™ Sub-G Module Series = 3.6V, ZICM0868P0) DD MeshConnect™ Sub-G Module Min Typ Max 865 – 870 – 13 – ...
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PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Number Name 1 GND 2 GND 3 GND 4 ...
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MeshConnect I/O PIN ASSIGNMENTS Number Name GND 38 GND 39 GND 40 GND 41 GND 42 P2.2 GPIO connected to LED2 on CEL Eval board 43 P2.1 GPIO connected to Switch 1 on CEL Eval ...
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SOFTWARE/FIRMWARE (Continued) • Self Healing (Orphan handling) • Point-to-Point network formation • Point-to-Multipoint (Star) network formation • Mesh network formation* • ACK • Wakeup Modes (Si100X) • Frequency Hopping • Unicast Addressing using 16-bit device IDs • Broadcast Addressing • ...
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MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. 1.413 1.300 1.200 1.100 1.021 1.005 1 .0.150 Ø 0.065 19 0.050 0.000 20 EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. ...
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PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5º of Tpeak Time from 25º to Tpeak Ramp down rate Pb-Free Solder Paste ...
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PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable ...
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... Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php CE Certification — Europe ZICM0868P0 (PENDING) The MeshConnect 868MHz RF modules will be tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards ...
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SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling ...
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REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version 0008-00-07-00-000 Initial preliminary datasheet. (Issue ES) April 5, 2011 Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual ...