hcts14dmsr Intersil Corporation, hcts14dmsr Datasheet
hcts14dmsr
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hcts14dmsr Summary of contents
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... This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The HCTS14MS is supplied lead Ceramic flatpack Package (K suffi lead SBDIP Package (D suffix). Ordering Information PART TEMPERATURE SCREENING NUMBER RANGE o o HCTS14DMSR - +125 C Intersil Class S Equivalent o o HCTS14KMSR - +125 C ...
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Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay TPHL VCC = 4.5V, VIH = 3.0V, VIL = 0V TPLH VCC = 4.5V, VIH = 3.0V, VIL = 0V Input Switch Point VT+ VCC = 4.5V VT- VCC = ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Output Voltage High VOH Input Leakage Current IIN Noise Immunity Functional Test FN Propagation Delay TPHL TPLH Input Switch Points VT+ VT- VH NOTES: 1. All voltages referenced to ...
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CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
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Die Characteristics DIE DIMENSIONS mils 2,20 x 2.24mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...