yas529 Yamatake Corporation, yas529 Datasheet

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yas529

Manufacturer Part Number
yas529
Description
Ms-3c Magnetic Field Sensor
Manufacturer
Yamatake Corporation
Datasheet

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YAS529 is the Triaxial Geomagnetic Sensor IC integrating buffer amplifier, A/D converter, clock generator,
and serial data interface circuit (supports I2C bus) on one chip package.
YAS529 allows you to make up a high sensitive, compact and low-power electronic compass in a portable
GPS system or a mobile phone.
● A manufacturing process that makes magnetic sensor on Si wafer with high precision realizes integration
● High sensitive geomagnetic sensor IC is realized by integrating magnetic sensors and low noise
● High noise immunity is improved by digitizing output from geomagnetic sensor IC.
● External interface supports I
● Geomagnetic sensor with superior high board density and low-power consumption.
● Automatic power-down control mode is available after geomagnetic measurements.
● Three A/D input pins for an inclination sensor
● Power-down control of an inclination sensor with a standby pin by the use of the General-Purpose Output
● Others.
Overview
Features
with peripheral circuits on one chip.
amplifiers.
(GPO) Pin
Manufacturing process ......................... CMOS + Magnetic Sensor
Package ................................................ Lead-free 10-pin WLCSP package (YAS529-PZ)
Supply voltage for core ........................ 2.5 V to 3.6 V
Supply voltage for Interface ................. 1.65 V to VDD (Operating temperature : -20 to +95 °C)
Operating temperature .......................... -40 to +95 °C (Supply for the interface : 2.30V to VDD)
Consumption current during operation.
Magnetic sensor section
Measuring time
Measuring magnetic field range .. ±300 µT
Resolution .................................... ≦0.6 µT/count (X,Y), ≦1.2 µT/count (Z)
Magnetic field measurement ....... 4 mA (VDD = 3.0 V)
Magnetic sensor measurement .... within 10 ms (Three axes collective measurement)
Inclination sensor A/D ................ within 10 ms (Three axes collective measurement)
YAS529
2
C bus (100kbps/400kbps, slave mode).
Magnetic field Sensor
MS-3C
2.30 V to VDD (Operating temperature : -40 to +95 °C)
CATALOG No.: LSI-BAS529A20
YAS529 CATALOG
2007.6

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yas529 Summary of contents

Page 1

... YAS529 is the Triaxial Geomagnetic Sensor IC integrating buffer amplifier, A/D converter, clock generator, and serial data interface circuit (supports I2C bus) on one chip package. YAS529 allows you to make up a high sensitive, compact and low-power electronic compass in a portable GPS system or a mobile phone. ...

Page 2

Pin Description Here are figures for pin assignment and a table for pin descriptions 10-pin WLCSP Top View Pin No. Pin Name 1 GPO 2 VSS 3 AIZ 4 AIX AIY 5 ...

Page 3

... Pin Functions Power Supply (VDD, IOVDD, VSS) These pins are for power supply of YAS529. VDD : Power Supply for core IOVDD : Power Supply for the Interface VSS : Ground Serial Data Interface (SCL, SDA, RSTN, GPO) SCL : Serial clock input pin These pins are used with an external pull-up resistor. ...

Page 4

... Block Diagram Here is the internal block diagram of YAS529. 4 Block Diagram ...

Page 5

... Function Descriptions Analog Circuit Section Magnetic Sensor ○ YAS529 includes three Magnetic Sensors. Only the sensor of an axis to measure at the time of magnetic field measurement is operated. Buffer Amplifier ○ The buffer amplifier amplifies a signal output from the bridge of magnetic sensor. The amplifier operates only when magnetic field measurement is made. ...

Page 6

... SDA (SDA) Communication is performed through the above pins. General-Purpose Output (GPO) Pin ○ YAS529 has GPO as general-purpose output pin. This output pin can be used for purposes such as power-down control of an inclination sensor with standby pin bus serial interface and operates in the slave mode. ...

Page 7

Example of System Configuration Here is an example of system configuration. When RSTN pin is not used, connect it to IOVDD pin. Example of system configuration (RSTN pin is not used) Example of system configuration 7 ...

Page 8

... Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer, the device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric effect. * Please mount the package without underfill because temperature correction may not be normally performed when mounting YAS529 on a board. 8 ...

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