xe1000-bd Mini-Circuits, xe1000-bd Datasheet

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xe1000-bd

Manufacturer Part Number
xe1000-bd
Description
2.0-16.0 Gaas Mmic Frequency Divider
Manufacturer
Mini-Circuits
Datasheet
Features
General Description
2.0-16.0 GHz GaAs MMIC
Frequency Divider
Mimix Broadband's 2.0-16.0 GHz GaAs MMIC freqency
divider is an ECL (Emitter Coupled Logic) static frequency
divider (divide-by-four) consisting of two cascaded
divide-by-two circuits. Even-order harmonic levels are
minimized by driving the inputs with a balanced input
signal, and by taking the output differentially, but the circuit
can be operated in a single-ended fashion with unused
inputs & outputs open circuit. This MMIC uses Mimix
Broadband's 2 um GaAs HBT device model technology to
ensure high reliability and uniformity. The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow either a
conductive epoxy or eutectic solder die attach process. This
device is well suited for Millimeter-wave Point-to-Point
Radio, LMDS, SATCOM and VSAT applications.
April 2007 - Rev 17-Apr-07
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
Divide-by-Four
+5.0 dBm Output Power
-30 dBc Fundamental Leakage
Single-ended or Differential Input & Output
100% On-Wafer, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883
Method 2010
Electrical Characteristics (Ambient Temperature T = 25
Input Frequency Range (f )
Output Frequency Range (f )
Input Power (Pin)
Output Power (Pout)
Fin Suppression
Fin/2 Suppression
3*Fin/4 Suppression
2*Fin Suppression
Supply Voltage (Vcc)
Supply Current (Icc) (Vcc=5.0V Typical)
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Parameter
their obligation to be compliant with U.S. Export Laws.
Chip Device Layout
Absolute Maximum Ratings
Supply Voltage (Vcc)
Supply Current (Icc)
Input Power (Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Junction Temperature (Tch)
(1) Junction temperature affects a device's MTTF. It is
recommended to keep channel temperature as low as
possible for maximum life.
Units
dBm
dBm
GHz
GHz
VDC
dBc
dBc
dBc
dBc
mA
-20.0
Min.
+4.0
2.0
0.5
-
-
-
-
-
-
-30.0
-25.0
-15.0
-35.0
Typ.
+5.0
+5.0
110
-
-
-
o
XE1000-BD
C)
+7.0 VDC
150 mA
+15 dBm
-65 to +165
-55 to MTTF Table
MTTF Table
Max.
16.0
+5.0
+6.0
E1000-BD
130
4.0
-
-
-
-
-
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xe1000-bd Summary of contents

Page 1

... Units GHz GHz dBm dBm dBc dBc dBc dBc VDC mA their obligation to be compliant with U.S. Export Laws. E1000-BD XE1000-BD +7.0 VDC 150 mA +15 dBm O -65 to +165 C 1 -55 to MTTF Table 1 MTTF Table o C) Min. Typ. ...

Page 2

GHz GaAs MMIC Frequency Divider April 2007 - Rev 17-Apr-07 Divider Measurements Output Harmonics & Sub-harmonics vs. Input Frequency 0 -10 -20 -30 -40 -50 - ...

Page 3

... XE1000-BD 0.795 (0.031) (Note: Engineering designator is 8SDV0500) All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond Pad #3 (RF In1) Bond Pad #4 (RF In2) RF In1 3 RF In2 4 XE1000-BD Vcc their obligation to be compliant with U.S. Export Laws. E1000-BD 0.525 3 (0.021) 0.325 4 (0.013) 2.000 (0 ...

Page 4

GHz GaAs MMIC Frequency Divider April 2007 - Rev 17-Apr-07 App Note [1] Biasing - As shown in the bonding diagram, this device is operated by biasing Vcc with Vcc=5.0 V and Icc=100 mA. App Note [2] Bias Arrangement ...

Page 5

... Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. Part Number for Ordering XE1000-BD-000V XE1000-BD-EV1 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. ...

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