MSA-0100-GP4 HP [Agilent(Hewlett-Packard)], MSA-0100-GP4 Datasheet

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MSA-0100-GP4

Manufacturer Part Number
MSA-0100-GP4
Description
Cascadable Silicon Bipolar MMIC Amplifier
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
5965-9689E
Cascadable Silicon Bipolar
MMIC Amplifier
Technical Data
Features
• Cascadable 50
• 3 dB Bandwidth:
• High Gain:
• Unconditionally Stable
Description
The MSA-0100 is a high performance
silicon bipolar Monolithic Microwave
Integrated Circuit (MMIC) chip. This
MMIC is designed for use as a general
purpose 50
applications include narrow and
broad band IF and RF amplifiers in
commercial, industrial and military
applications.
Typical Biasing Configuration
IN
DC to 1.3 GHz
18.5 dB Typical at 0.5 GHz
(k>1)
C
block
gain block. Typical
MSA
Gain Block
V
d
= 5 V
RFC (Optional)
R
C
bias
block
The MSA-series is fabricated using
HP’s 10 GHz f
bipolar MMIC process which uses
nitride self-alignment, ion implanta-
tion, and gold metallization to
achieve excellent performance,
uniformity and reliability. The use
of an external bias resistor for
temperature and current stability
also allows bias flexibility.
The recommended assembly
procedure is gold-eutectic die
attach at 400 C and either wedge or
ball bonding using 0.7 mil gold
wire.
“Chip Use”.
V
OUT
CC
[1]
> 7 V
See APPLICATIONS section,
T
, 25 GHz f
6-242
MAX
, silicon
MSA-0100
Chip Outline
Note:
1. This chip contains additional biasing
options. The performance specified
applies only to the bias option whose
bond pads are indicated on the chip
outline. Refer to the APPLICATIONS
section “Silicon MMIC Chip Use” for
additional information.
[1]

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MSA-0100-GP4 Summary of contents

Page 1

... Bandwidth 1.3 GHz • High Gain: 18.5 dB Typical at 0.5 GHz • Unconditionally Stable (k>1) Description The MSA-0100 is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) chip. This MMIC is designed for use as a general purpose 50 gain block. Typical applications include narrow and ...

Page 2

... The recommended operating current range for this device mA. Typical performance as a function of current is on the following page performance of the chip is determined by packaging and testing 10 devices per wafer in a dual ground configuration. Part Number Ordering Information Part Number MSA-0100-GP4 [1] Absolute Maximum 40 mA 200 mW ...

Page 3

... Note: 1. S-parameters are de-embedded from 70 mil package measured data using the package model found in the DEVICE MODELS section. MSA-0100 Typical Performance, T (unless otherwise noted Gain Flat 0.1 0.3 0.5 1.0 3.0 6.0 FREQUENCY (GHz) Figure 1. Typical Power Gain vs. ...

Page 4

... MSA-0100 Chip Dimensions NOT APPLICABLE INPUT GROUND 394 m 15.5 mil Chip thickness is 114 m/4.5 mil. Bond Pads are 41 m/1.6 mil typical on each side. Note 1: Output contact is made by die attaching the backside of the die. 394 m 15.5 mil OPTIONAL [1] OUTPUT 6-245 ...

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