MMBFJ177LT1G_11 ONSEMI [ON Semiconductor], MMBFJ177LT1G_11 Datasheet
MMBFJ177LT1G_11
Manufacturer Part Number
MMBFJ177LT1G_11
Description
JFET Chopper
Manufacturer
ONSEMI [ON Semiconductor]
Datasheet
1.MMBFJ177LT1G_11.pdf
(3 pages)
MMBFJ177LT1G
JFET Chopper
P−Channel − Depletion
Features
•
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 0.75 0.062 in.
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 5
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Drain−Gate Voltage
Reverse Gate−Source Voltage
Total Device Dissipation FR− 5 Board
Thermal Resistance,
Junction and Storage Temperature
Compliant
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(Note 1)
T
Derate above 25°C
Junction−to−Ambient
A
= 25°C
Rating
Symbol
T
V
R
V
J
GS(r)
P
, T
DG
qJA
D
stg
−55 to +150
Value
−25
225
556
1.8
25
1
mW/°C
°C/W
Unit
Vdc
Vdc
mW
°C
†For information on tape and reel specifications,
MMBFJ177LT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Device
(Note: Microdot may be in either location)
1
ORDERING INFORMATION
2
6Y = Specific Device Code
M
G
GATE
MARKING DIAGRAM
3
http://onsemi.com
3
= Date Code*
= Pb−Free Package
1
(Pb−Free)
Package
SOT−23
6Y MG
SOT−23 (TO−236AB)
Publication Order Number:
G
CASE 318−08
1 DRAIN
2 SOURCE
STYLE 10
3000 Tape & Reel
MMBFJ177LT1/D
Shipping
†
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MMBFJ177LT1G_11 Summary of contents
Page 1
MMBFJ177LT1G JFET Chopper P−Channel − Depletion Features • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Drain−Gate Voltage Reverse Gate−Source Voltage Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings ...
Page 2
ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Gate−Source Breakdown Voltage ( Gate Reverse Current ( Vdc Gate Source Cutoff Voltage ( Vdc CHARACTERISTICS Zero−Gate−Voltage Drain Current (V GS ...
Page 3
D SEE VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are ...