ACS11K INTERSIL [Intersil Corporation], ACS11K Datasheet
ACS11K
Manufacturer Part Number
ACS11K
Description
Radiation Hardened Triple 3-Input AND Gate
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.ACS11K.pdf
(2 pages)
Radiation Hardened Triple 3-Input AND
Gate
The Radiation Hardened ACS11MS is a Triple 3-Input AND
Gate. When all three inputs to one of the gates are at a
HIGH level, the corresponding Y output will be HIGH. A LOW
level on any input will cause the output for that gate to be
LOW. All inputs are buffered and the outputs are designed
for balanced propagation delay and transition times.
The ACS11MS is fabricated on a CMOS Silicon on Sapphire
(SOS) process, which provides an immunity to Single Event
Latch-up and the capability of highly reliable performance in
any radiation environment. These devices offer significant
power reduction and faster performance when compared to
ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS11MS are
contained in SMD 5962-98622. A “hot-link” is provided
on our homepage with instructions for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
Ordering Information
Pinouts
5962F9862201VCC
ACS11D/SAMPLE-03
5962F9862201VXC
ACS11K/SAMPLE-03
5962F9862201V9A
ORDERING NUMBER
GND
A1
B1
A2
B2
C2
Y2
1
2
3
4
5
6
7
TOP VIEW
ACS11MS
(SBDIP)
1
ACS11DMSR-03
ACS11D/SAMPLE-03
ACS11KMSR-03
ACS11K/SAMPLE-03
ACS11HMSR-03
INTERNAL MKT. NUMBER
Data Sheet
14
13
12
10
11
9
8
V
C1
Y1
C3
B3
A3
Y3
CC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
TEMP. RANGE (
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
• Input Logic Levels . . . . V
• Output Current . . . . . . . . . . . . . . . . . . . . . . . .
• Quiescent Supply Current . . . . . . . . . . . . . . 100 A (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 12ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
-55 to 125
-55 to 125
- Latch-Up Free Under any Conditions
- Total Dose. . . . . . . . . . . . . . . . . . . . . . 3 x 10
- SEU Immunity . . . . . . . . . . . . . <1 x 10
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
GND
25
25
25
A1
B1
A2
B2
C2
Y2
November 1998
o
C)
14 Ld SBDIP
14 Ld SBDIP
14 Ld Flatpack
14 Ld Flatpack
Die
(FLATPACK)
1
2
3
4
5
6
7
PACKAGE
TOP VIEW
ACS11MS
IL
= (0.3)(V
File Number
14
13
12
11
10
9
8
CC
ACS11MS
), V
-10
CDIP2-T14
CDIP2-T14
CDFP4-F14
CDFP4-F14
N/A
DESIGNATOR
IH
Errors/Bit/Day
= (0.7)(V
5
8mA (Min)
RAD (Si)
V
C1
Y1
C3
B3
A3
Y3
4543
CC
CC
2
)
)
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ACS11K Summary of contents
Page 1
... Detailed Electrical Specifications for the ACS11MS are contained in SMD 5962-98622. A “hot-link” is provided on our homepage with instructions for downloading. www.intersil.com/spacedefense/newsafclasst.asp Ordering Information ORDERING NUMBER INTERNAL MKT. NUMBER 5962F9862201VCC ACS11DMSR-03 ACS11D/SAMPLE-03 ACS11D/SAMPLE-03 5962F9862201VXC ACS11KMSR-03 ACS11K/SAMPLE-03 ACS11K/SAMPLE-03 5962F9862201V9A ACS11HMSR-03 Pinouts ACS11MS (SBDIP) TOP VIEW ...
Page 2
Die Characteristics DIE DIMENSIONS: Size: 2390 m x 2390 m (94 mils x 94 mils) Thickness: 525 (20.6 mils 1 mil) Bond Pad: 110 m x 110 m (4.3 x 4.3 mils) METALLIZATION: AI Metal 1 Thickness: ...