ACS157DMSR-02 INTERSIL [Intersil Corporation], ACS157DMSR-02 Datasheet

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ACS157DMSR-02

Manufacturer Part Number
ACS157DMSR-02
Description
Radiation Hardened Quad 2-Input Non-Inverting Multiplexer
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
December 1997
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25Micron Radiation Hardened SOS CMOS
• Radiation Environment
• Input Logic Levels . . . V
• Output Current
• Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20 A
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . . 14ns
Applications
• 4-Bit Source Selection
• Data Routing
• High Frequency Switching
Ordering Information
Pinouts
5962F9853601VEC
N/A
5962F9853601VXC
N/A
N/A
- Latch-up Free Under any Conditions
- Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 10
- SEU Immunity . . . . . . . . . . . <1 x 10
- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm
SMD PART NUMBER
GND
1I
1I
2I
2I
1Y
2Y
S
0
1
0
1
1
2
3
4
5
6
7
8
ACS157 (SBDIP)
TOP VIEW
IL
= (0.3)(Vcc), V
ACS157DMSR-02
ACS157D/Sample-02
ACS157KMSR-02
ACS157K/Sample-02
ACS157HMSR-02
INTERSIL PART NUMBER
16
15
14
13
12
11
10
9
VCC
E
4I
4I
4Y
3I
3I
3Y
0
1
0
1
-10
Errors/Bit/Day
IH
= (0.7)(Vcc)
5
RAD(Si)
12mA
2
)
1
Quad 2-Input Non-Inverting Multiplexer
TEMP. RANGE (
Description
The Radiation Hardened ACS157MS is a Quad 2-Channel
Non-Inverting Multiplexer which selects four bits of data from
one of two sources under the control of a single Select pin.
The Output Enable input is active LOW and controls all out-
puts. When E is set HIGH, all outputs are forced LOW,
regardless of all other input conditions. All inputs are buff-
ered and the outputs are designed for balanced propagation
delay and transition times.
The ACS157MS is fabricated on a CMOS Silicon on Sap-
phire (SOS) process, which provides an immunity to Single
Event Latch-up and the capability of highly reliable perfor-
mance in any radiation environment. These devices offer
significant power reduction and faster performance when
compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS157 are
contained in SMD 5962-98536. A “hot-link” is provided
on our homepage with instructions for downloading.
http://www.intersil.com/data/sm/index.htm
GND
-55 to 125
-55 to 125
1I
1I
2I
2I
1Y
2Y
S
0
1
0
1
25
25
25
ACS157MS
o
C)
ACS157 (FLATPACK)
16 Ld SBDIP
16 Ld SBDIP
16 Ld Flatpack
16 Ld Flatpack
Die
1
2
3
4
5
6
7
8
TOP VIEW
PACKAGE
Radiation Hardened
16
15
14
13
12
11
10
9
File Number
CDIP2-T16
CDIP2-T16
CDFP4-F16
CDFP4-F16
N/A
CASE OUTLINE
V
E
4I
4I
4Y
3I
3I
3Y
CC
0
1
0
1
4462

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ACS157DMSR-02 Summary of contents

Page 1

... Output Current • Quiescent Supply Current .20 A • Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . . 14ns Applications • 4-Bit Source Selection • Data Routing • High Frequency Switching Ordering Information SMD PART NUMBER INTERSIL PART NUMBER 5962F9853601VEC ACS157DMSR-02 N/A ACS157D/Sample-02 5962F9853601VXC ACS157KMSR-02 N/A ACS157K/Sample-02 N/A ACS157HMSR-02 Pinouts ACS157 (SBDIP) ...

Page 2

Die Characteristics DIE DIMENSIONS: Size: 2390 m x 2390 m (94 mils x 94 mils) Thickness: 525 (20.6 mils 1 mil) Bond Pad: 110 m x 110 m (4.3 x 4.3 mils) METALLIZATION: Al Metal 1 Thickness: ...

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