MC74HC08ANG ON Semiconductor, MC74HC08ANG Datasheet - Page 8

IC GATE AND QUAD 2INPUT 14DIP

MC74HC08ANG

Manufacturer Part Number
MC74HC08ANG
Description
IC GATE AND QUAD 2INPUT 14DIP
Manufacturer
ON Semiconductor
Series
74HCr
Datasheets

Specifications of MC74HC08ANG

Logic Type
AND Gate
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
5.2mA, 5.2mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Logic Family
HC
Logical Function
AND
Number Of Elements
4
High Level Output Current
-5.2mA
Low Level Output Current
5.2mA
Propagation Delay Time
110ns
Operating Supply Voltage (typ)
2.5/3.3/5V
Operating Temp Range
-55C to 125C
Package Type
PDIP
Number Of Outputs
1
Technology
CMOS
Mounting
Through Hole
Pin Count
14
Operating Temperature Classification
Military
Quiescent Current
1uA
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
2V
Product
AND
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Circuit Type
Low-Power Schottky
Current, Supply
40 μA
Function Type
2-Inputs
Logic Function
AND Gate
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
2 to 6 V
No. Of Inputs
2
Supply Voltage Range
2V To 6V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Output Current
4mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HC08ANGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC74HC08ANG
Manufacturer:
IXYS
Quantity:
104
Part Number:
MC74HC08ANG
Manufacturer:
ON
Quantity:
19 022
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
PACKAGE DIMENSIONS
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
8
SECTION N−N
Ç Ç Ç
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_

Related parts for MC74HC08ANG