MC14070BCPG ON Semiconductor, MC14070BCPG Datasheet - Page 6

IC GATE OR EXCLUSIVE CMOS 14DIP

MC14070BCPG

Manufacturer Part Number
MC14070BCPG
Description
IC GATE OR EXCLUSIVE CMOS 14DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheets

Specifications of MC14070BCPG

Logic Type
XOR (Exclusive OR)
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
3.4mA, 3.4mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Product
XOR
Logic Family
MC140
High Level Output Current
- 4.2 mA
Low Level Output Current
4.2 mA
Propagation Delay Time
350 ns
Supply Voltage (max)
18 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Circuit Type
Low-Power Schottky
Current, Supply
30 μA
Function Type
4-Channels
Logic Function
OR Gate
Package Type
PDIP-14
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Logical Function
XOR
Number Of Elements
4
Operating Supply Voltage (typ)
3.3/5/9/12/15V
Operating Temp Range
-55C to 125C
Number Of Outputs
1
Technology
CMOS
Mounting
Through Hole
Pin Count
14
Operating Temperature Classification
Military
Quiescent Current
1uA
Operating Supply Voltage (max)
18V
Operating Supply Voltage (min)
3V
Output Current
8.8mA
No. Of Inputs
2
Supply Voltage Range
3V To 18V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Family Type
4000 CMOS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14070BCPGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC14070BCPG
Manufacturer:
ON
Quantity:
8 000
Part Number:
MC14070BCPG
Manufacturer:
ON/安森美
Quantity:
20 000
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
B
7X
6
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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