ilx551b Sony Electronics, ilx551b Datasheet

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ilx551b

Manufacturer Part Number
ilx551b
Description
2048-pixel Ccd Linear Sensor B/w
Manufacturer
Sony Electronics
Datasheet

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Part Number
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Quantity
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Part Number:
ILX551B
Manufacturer:
FUJ
Quantity:
6 234
Description
designed for facsimile, image scanner and OCR use.
This sensor reads B4 size documents at a density of
200DPI (Dot Per Inch). A built-in timing generator
and clock-drivers ensure direct drive at 5V logic for
easy use.
Features
• Number of effective pixels: 2048 pixels
• Pixel size: 14µm
• Built-in timing generator and clock-drivers
• Ultra low lag
• Maximum clock frequency: 5MHz
Absolute Maximum Ratings
• Supply voltage
• Operating temperature
• Storage temperature
Pin Configuration (Top View)
The ILX551B is a reduction type CCD linear sensor
2048-pixel CCD Linear Sensor (B/W)
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
SHSW
V
ROG
V
V
CLK
OUT
DD2
DD2
NC
NC
NC
NC
NC
10
11
1
2
3
4
5
6
7
8
9
14µm (14µm pitch)
2048
1
V
V
DD1
DD2
22
21
20
19
18
17
16
15
14
13
12
–10 to +55
–30 to +80
V
V
V
GND
NC
GND
NC
NC
NC
NC
GND
DD2
DD2
DD1
11
6
°C
°C
V
V
– 1 –
Block Diagram
S2048
S2047
D39
D38
D37
D36
D35
D34
D33
D15
D14
22 pin DIP (Cer-DIP)
S2
S1
ILX551B
E01Y35

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ilx551b Summary of contents

Page 1

... CCD Linear Sensor (B/W) Description The ILX551B is a reduction type CCD linear sensor designed for facsimile, image scanner and OCR use. This sensor reads B4 size documents at a density of 200DPI (Dot Per Inch). A built-in timing generator and clock-drivers ensure direct drive at 5V logic for easy use ...

Page 2

... Unit 9.5 V 5.25 V (9V) and then V DD1 DD2 (5V) and then V (9V). DD2 DD1 Min. Typ. Max. — 10 — CLK — 10 — ROG Typ. Max. Unit 5.0 5.5 V — 0.5 V – 2 – ILX551B Description GND GND NC GND 9V power supply 5V power supply 5V power supply (5V). Unit pF pF ...

Page 3

... I VDD1 1.8 — I VDD2 97.0 TTE 92.0 600 Z — O 4.0 — 100 [%] , the minimum output to V and the average output to V MAX MIN D33 S1 – 3 – ILX551B Max. Unit Remarks 50 V/(lx · s) Note 1 8.0 % Note 2 — V — 2.0 mV Note 3 3.0 mV Note 3 — % Note 4 — — Note 5 — ...

Page 4

Fig.1. Clock Timing Diagram (without S/H mode) 5 ROG 0 5 CLK 0 V OUT Dummy signal (33 pixels) Optical black (18 pixels) Effective picture elements signal (2048 pixels) 1-line output period (2087 pixels) Dummy signal (6 pixels) ...

Page 5

... Min — Symbol Min 500 500 – 5 – ILX551B Typ. Max. Unit — 110 ns 75 120 ns t10 t11 Typ. Max. Unit 1000 — — ns 1000 — ns ...

Page 6

... Ta – Ambient temperature [˚C] Spectral sensitivity characteristics (Standard characteristics) 500 600 700 800 Wavelength [nm DD1 DD2 0.5 0 0.1M – 6 – ILX551B Ta=25˚C 900 1000 supply current vs. Clock frequency (Standard characteristics) I VDD1 I VDD2 1M 5M Clock frequency [Hz] ...

Page 7

Application Circuit 0.01µ 10µ/16V 3k Output signal 2SA1175 Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits ...

Page 8

... For repairs and remount, cool sufficiently dismount image sensors, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 29N 29N (2) (3) – 8 – ILX551B 0.9Nm (4) ...

Page 9

... Keep in case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. – 9 – ILX551B ...

Page 10

Package Outline Unit pin DIP (400mil) 41.6 ± 0.5 28.672 (14µm X 2048Pixels) 7.35 ± 0 No.1 Pixel H 1 2.54 PACKAGE STRUCTURE Cer-DIP PACKAGE MATERIAL TIN PLATING LEAD TREATMENT 42 ALLOY LEAD MATERIAL PACKAGE MASS ...

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