cxa1600m Sony Electronics, cxa1600m Datasheet
cxa1600m
Related parts for cxa1600m
cxa1600m Summary of contents
Page 1
... Single-chip AM Radio with Built-in Power Amplifier For the availability of this product, please contact the sales office. Description The CXA1600M 8-pin single-chip bipolar IC for AM radios. This IC includes all functions from the front-end to the power amplifier. The CXA1600M/P doesn’t require any external filter, making external ceramic filter attachment unnecessary ...
Page 2
... GND VOL GND OUT GND OSC GND —2— CXA1600M Description Connect with a capacitor. Connect to the midpoint of the volume control. Ground Audio output. Connect with a capacitor. Power supply Oscillation output. Connect with an oscillation coil. ...
Page 3
... Vin=35 dBµV. Equivalent Circuit AGC GND GND Test conditions =1 kHz MOD =1 kHz MOD =1 kHz MOD —3— CXA1600M/P Description Connect with a capacitor. RF input. Connect with the antenna circuit Ta=25 °C CC Min. Typ. Max. Unit 4 100 mW –70 – ...
Page 4
... Input frequency (f AM I/O Characteristics S+N V =3V CC f=1MHz f MOD =30% MOD Noise THD 100 0 –10 –20 –30 –40 –50 –60 –50 –40 –30 –20 – [kHz —4— CXA1600M/P =1kHz 110 120 20 30 ...
Page 5
... Bar ANT AMP OVERLOAD AGC AGC AGC 1 The CXA1600M/P operates on the new system using very low intermediate frequency (approx. 55 kHz). (Actual IF frequency is determined by internal B.P.F.fo –f 55 kHz IF OSC IN 2 Please take care of choice of the coil and variable capacitor as follows. (See next page.) ...
Page 6
... 130 70 f (kHz) L (µ 796 560 140 L (µH) Q Number of widings (µ 210 70 f (kHz) L (µ 796 900 180 —6— CXA1600M 32.5 97 420 71.3 138 720 ...
Page 7
... D1, D2: 1S1555 OSC COIL C3 1500p GND AGC LO OSC MIXER BPF VOL AF POWER AMP VOL GND 2 3 GND —7— CXA1600M/P VARIABLE CAPACITOR: HQ-025A of Toko Co., Ltd. or equivalent GND OSC IF AMP IF DET SP OUT 4 C6 220 8 SP GND ...
Page 8
... D1, D2: 1S1555 OSC COIL GND AGC LO OSC MIXER BPF AF POWER AMP VOL VOL GND 2 3 GND —8— CXA1600M/P VARIABLE CAPACITOR: C =160p, C =80p RF OSC GND OSC IF AMP IF DET SP OUT 4 C6 220 ...
Page 9
... LEAD MATERIAL 42/COPPER ALLOY PACKAGE MASS 0.1g 8PIN DIP (PLASTIC) + 0.4 9.4 – 0 2.54 0.5 ± 0.1 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING DIP-8P-01 DIP008-P-0300 LEAD MATERIAL COPPER ALLOY 0.5g PACKAGE MASS —9— CXA1600M/P + 0.4 1.25 – 0.15 0.10 + 0.15 0.1 – 0.1 PLATING 0° to 15° ...