icx424al Sony Electronics, icx424al Datasheet

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icx424al

Manufacturer Part Number
icx424al
Description
Diagonal 6mm Type 1/3 Progressive Scanccd Solid-state Image Sensor With Square Pixel Forb/w Cameras
Manufacturer
Sony Electronics
Datasheet

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ICX424AL
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Description
CCD solid-state image sensor with a square pixel
array suitable for EIA black-and-white cameras.
Progressive scan allows all pixel's signals to be output
independently within approximately 1/60 second. This
chip features an electronic shutter with variable
charge-storage time which makes it possible to
realize full-frame still images without a mechanical
shutter. High sensitivity and low dark current are
achieved through the adoption of the HAD (Hole-
Accumulation Diode) sensors.
and surveillance cameras.
Features
• Progressive scan allows individual readout of the image signals
• High vertical resolution (480 TV-lines) still images without a
• Square pixel
• Supports VGA format
• Horizontal drive frequency: 24.54MHz
• No voltage adjustments (reset gate and substrate bias are not
• High resolution, high sensitivity, low dark current
• Continuous variable-speed shutter
• Low smear
• Excellent anti-blooming characteristics
• Horizontal register: 5.0V drive
• 16-pin high precision plastic package (enables dual-surface standard)
Device Structure
• Interline CCD image sensor
• Image size:
• Number of effective pixels: 659 (H)
• Total number of pixels:
• Chip size:
• Unit cell size:
• Optical black:
• Number of dummy bits:
• Substrate material:
The ICX424AL is a diagonal 6mm (Type 1/3) interline
This chip is suitable for applications such as FA
from all pixels.
mechanical shutter
adjusted.)
Diagonal 6mm (Type 1/3) Progressive Scan CCD Solid-state Image Sensor with Square Pixel for B/W Cameras
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Diagonal 6mm (Type 1/3)
692 (H)
5.79mm (H)
7.4µm (H)
Horizontal (H) direction: Front 2 pixels, rear 31 pixels
Vertical (V) direction:
Horizontal 16
Vertical 5
Silicon
494 (V) approx. 330K pixels
504 (V) approx. 350K pixels
7.4µm (V)
4.89mm (V)
– 1 –
Front 8 pixels, rear 2 pixels
ICX424AL
16 pin DIP (Plastic)
2
V
Optical black position
Pin 9
(Top View)
H
Pin 1
31
E01Z09D3Z
8
2

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icx424al Summary of contents

Page 1

... Diagonal 6mm (Type 1/3) Progressive Scan CCD Solid-state Image Sensor with Square Pixel for B/W Cameras Description The ICX424AL is a diagonal 6mm (Type 1/3) interline CCD solid-state image sensor with a square pixel array suitable for EIA black-and-white cameras. Progressive scan allows all pixel's signals to be output independently within approximately 1/60 second ...

Page 2

... The terms and conditions in the Sony additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products. – 2 – ICX424AL ...

Page 3

... Note) Note) : Photo sensor 16 Description V Supply voltage DD Supply voltage for the substrate SUBCIR voltage generation GND GND SUB Substrate clock V Protective transistor bias L RG Reset gate clock H Horizontal register transfer clock 1 H Horizontal register transfer clock 2 ICX424AL ...

Page 4

... Ratings Unit Remarks –0.3 to +36 V –0.3 to +18 V – – +16 V –16 to +16 V –10 to +15 V –55 to +10 V –65 to +0.3 V –0.3 to +27.5 V –0.3 to +20.5 V –0.3 to +17.5 V –30 to +80 °C –10 to +60 °C –10 to +75 °C ICX424AL 2 ...

Page 5

... V 2 (During 24.54MHz VL1 V 2 (During 12.27MHz High-level coupling V 2 High-level coupling V 2 Low-level coupling V 2 Low-level coupling Cross-point voltage Low-level coupling V 4 Low-level coupling V 5 ICX424AL power L )/2 VL3 )/2 VL3 ...

Page 6

... V23 Horizontal transfer clock equivalent circuit C RG – 6 – Typ. Min. Max. Unit Remarks 3900 pF 3300 pF 3300 pF 1000 pF 1000 pF 1000 560 100 , ICX424AL ...

Page 7

... VHH V VHL V VLH V VL2 V VLL V VH3 V VHH V VHL V VLH VH02 + V )/2 VL01 VL03 – 7 – VL03 M 0V and – VH1 VL01 – VH02 VL2 – VH3 VL03 ICX424AL ...

Page 8

... Point A is the minimum value of the coupling waveform during the period from RGLL and V . RGLH RGLL RGLm 100% 90% V SUB 10 twh – 8 – twl V HL and H waveforms and H is two twl . ICX424AL . CR V RGL ...

Page 9

... Unit During 0.5 0.5 µs readout When using 15 350 ns CXD3400N 10 17 When draining 0.5 0.5 µs charge 1 and H is two ICX424AL Remarks During readout When using CXD3400N tf tr – 2ns When draining charge Remarks tr – 2ns ...

Page 10

... H 8 494 (V) Zone Zone II, II' Ignored region Effective pixel region AMP S/H – 10 – Remarks 1 1/30s accumulation conversion value 60° Zone Zone 60° 60°C 7 Signal output [ B] ICX424AL (Ta = 25°C) ...

Page 11

... There are the mode (120 frames/s) which outputs 222 lines of an output line portion, and the mode (240 frames/s) which outputs 76 lines. (2) Field readout mode V OUT (3) Center scan mode Undesired portions (Swept by vertical register high-speed transfer) Picture center cut-out portion – 11 – ICX424AL ...

Page 12

... Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference color temperature of 3200K halogen source subject. 1 [dB] (1/10V method conversion value) 10 – 12 – ICX424AL ...

Page 13

... Adjust the signal output generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) 100 [%] VD V2 Strobe light timing Output Light Signal output 150mV Vlag (lag) – 13 – ICX424AL ...

Page 14

Drive Circuit 15V 0.1 3.3V 1 XSUB 2 XV3 3 4 XSG3 5 CXD3400N XV2 6 7 XSG2 8 9 XV1 100k 0.1 1/35V 0 ...

Page 15

... Spectral Sensitivity Characteristics (Excludes lens characteristics and light source characteristics) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wave Length [nm] – 15 – 800 900 1000 ICX424AL ...

Page 16

Drive Timing Chart (Vertical Sync) Progressive Scan Mode VD "a" OUT ...

Page 17

Drive Timing Chart (Vertical Sync "a" Enlarged) "a" Enlarged Progressive Scan Mode/Center Scand Mode 520 582 ...

Page 18

Drive Timing Chart (Horizontal Sync) Progressive Scan Mode CLK H1 H2 SHP SHD SUB ...

Page 19

Drive Timing Chart (Vertical Sync) Center Scan Mode 1 VD "d" "a" OUT "b" "c" "d" "a" "b" ...

Page 20

Drive Timing Chart (Horizontal Sync) Center Scan Mode 1 (Frame Shift) ("b" 10920 bits = 14H #142 ...

Page 21

Drive Timing Chart (Horizontal Sync) Center Scan Mode 1 (High-speed Sweep) ("d" 12480 bits = 16H #167 ...

Page 22

Drive Timing Chart (Vertical Sync) Center Scan Mode 2 VD "d" "a" OUT "b" "c" "d" "a" "b" ...

Page 23

Drive Timing Chart (Horizontal Sync) Center Scan Mode 2 (Frame Shift) ("b" 15600 bits = 20H #215 ...

Page 24

Drive Timing Chart (Horizontal Sync) Center Scan Mode 2 (High-speed Sweep) ("d" 18720 bits = 24H #255 ...

Page 25

Drive Timing Chart (Vertical Sync) Field Readout Mode FLD OUT "a" "b" ...

Page 26

Drive Timing Chart (Vertical Sync "a", "b" Enlarged) H1 "a" Enlarged "b" Enlarged Field Readout Mode 520 582 ...

Page 27

Drive Timing Chart (Horizontal Sync) Field Readout Mode CLK H1 H2 SHP SHD SUB ...

Page 28

... If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate adhesive. 50N 50N Compressive strength – 28 – ICX424AL 1.2Nm Torsional strength ...

Page 29

... This package has 2 kinds internal structure. However, their package outline, optical size, and strength are the same. Cross section of lead frame The cross section of lead frame can be seen on the side of package for structure A. Structure A Package Chip Metal plate (lead frame) – 29 – ICX424AL Structure B ...

Page 30

Package Outline Unit 1.2 10.3 12.2 ± 0.1 9.2 0.69 (First pin only) 1.27 0.3 PACKAGE STRUCTURE Plastic PACKAGE MATERIAL LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 0.90g DRAWING NUMBER ...

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