HEF4075BP,652 NXP Semiconductors, HEF4075BP,652 Datasheet - Page 16

IC GATE OR TRIPLE 3INPUT 14DIP

HEF4075BP,652

Manufacturer Part Number
HEF4075BP,652
Description
IC GATE OR TRIPLE 3INPUT 14DIP
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheets

Specifications of HEF4075BP,652

Number Of Circuits
3
Package / Case
14-DIP (0.300", 7.62mm)
Logic Type
OR Gate
Number Of Inputs
3
Current - Output High, Low
2.4mA, 2.4mA
Voltage - Supply
4.5 V ~ 15.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Product
OR
Logic Family
HEF4000
High Level Output Current
- 3.6 mA
Low Level Output Current
3.6 mA
Propagation Delay Time
25 ns
Supply Voltage (max)
15.5 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1700-5
933324280652
HEF4075BPN
Philips Semiconductors
January 1995
DIP18: plastic dual in-line package; 18 leads (300 mil)
Package information
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
SOT102-1
VERSION
OUTLINE
max.
0.19
4.7
A
L
Z
18
0.020
1
min.
0.51
A
1
max.
0.15
A
3.7
IEC
pin 1 index
2
0.055
0.044
1.40
1.14
b
0.021
0.015
0.53
0.38
b
e
1
JEDEC
D
0.055
0.044
1.40
1.14
b
REFERENCES
2
0
0.013
0.009
0.32
0.23
c
b
scale
EIAJ
21.8
21.4
D
0.86
0.84
16
5
(1)
6.48
6.20
0.26
0.24
10
E
9
b
(1)
1
A
10 mm
b
1
2.54
0.10
2
e
w
A
E
2
M
A
7.62
0.30
e
1
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
c
Package outlines
8.25
7.80
0.32
0.31
M
E
(e )
M
M
1
H
E
0.37
0.33
M
9.5
8.3
H
ISSUE DATE
0.254
0.01
93-10-14
95-01-23
w
SOT102-1
0.033
max.
0.85
Z
(1)

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