HEF4075BP,652 NXP Semiconductors, HEF4075BP,652 Datasheet - Page 3

IC GATE OR TRIPLE 3INPUT 14DIP

HEF4075BP,652

Manufacturer Part Number
HEF4075BP,652
Description
IC GATE OR TRIPLE 3INPUT 14DIP
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheets

Specifications of HEF4075BP,652

Number Of Circuits
3
Package / Case
14-DIP (0.300", 7.62mm)
Logic Type
OR Gate
Number Of Inputs
3
Current - Output High, Low
2.4mA, 2.4mA
Voltage - Supply
4.5 V ~ 15.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Product
OR
Logic Family
HEF4000
High Level Output Current
- 3.6 mA
Low Level Output Current
3.6 mA
Propagation Delay Time
25 ns
Supply Voltage (max)
15.5 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1700-5
933324280652
HEF4075BPN
Philips Semiconductors
SO
SO14: plastic small outline package; 14 leads; body width 3.9 mm
January 1995
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Package information
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT108-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
14
1
1
Z
pin 1 index
y
0.057
0.049
1.45
1.25
A
076E06S
2
IEC
0.25
0.01
e
A
3
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
MS-012AB
0.25
0.19
JEDEC
c
REFERENCES
8.75
8.55
0.35
0.34
D
(1)
0
0.16
0.15
E
4.0
3.8
b
(1)
p
8
7
scale
0.050
EIAJ
1.27
2.5
3
e
w
M
c
0.244
0.228
H
6.2
5.8
E
A
2
0.041
5 mm
1.05
A
L
1
0.039
0.016
1.0
0.4
L
p
H
E
E
0.028
0.024
detail X
0.7
0.6
Q
L
PROJECTION
L
EUROPEAN
0.01
0.25
p
Q
v
Package outlines
(A )
3
A
0.25
0.01
w
A
0.004
0.1
X
v
y
M
ISSUE DATE
95-01-23
97-05-22
0.028
0.012
A
Z
0.7
0.3
(1)
SOT108-1
8
0
o
o

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