ht93lc66 Holtek Semiconductor Inc., ht93lc66 Datasheet
ht93lc66
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ht93lc66 Summary of contents
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... Write cycle time: 5ms max. Automatic erase-before-write operation General Description The HT93LC66 is a 4K-bit low voltage nonvolatile, serial electrically erasable programmable read only memory de- vice using the CMOS floating gate process. Its 4096 bits of memory are organized into 256 words of 16 bits each when the ORG pin is connected to VCC or organized into 512 words of 8 bits each when it is tied to VSS ...
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... CS=0V 5V OUT 2~5.5V 5V 2~5. =2.1mA OL 2~5. 400 A OH 2~5. =0V, f=250kHz IN V =0V, f=250kHz OUT 2 HT93LC66 V 0. +0. Min. Typ. Max. Unit 2.2 5 0 0.9V ...
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... HT93LC66 V =2.2V CC Unit Min. Max. 0 250 kHz 2000 ns 2000 ns 200 1000 ns 400 ns 400 ns 2000 ns 2000 ns ns 400 ...
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... The HT93LC66 is accessed via a three-wire serial com- munication interface. The device is arranged into 256 words by 16 bits or 512 words by 8 bits depending whether the ORG pin is connected to VCC or VSS. The HT93LC66 contains seven instructions: READ, ERASE, WRITE, EWEN, EWDS, ERAL and WRAL. When the user ...
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... Timing Diagrams READ EWEN/EWDS WRITE ERASE Rev. 1.40 5 HT93LC66 October 25, 2007 ...
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... WRAL Write All Note: X stands for don t care Rev. 1.40 Address Start Op ORG=0 ORG=1 bit Code X8 X16 1 10 A8~A0 A7~ A8~A0 A7~ A8~A0 A7~ 11XXXXXXX 11XXXXXX 1 00 00XXXXXXX 00XXXXXX 1 00 10XXXXXXX 10XXXXXX 1 00 01XXXXXXX 01XXXXXX 6 HT93LC66 Data ORG=0 ORG=1 X8 X16 D7~D0 D15~D0 D7~D0 D15~D0 D7~D0 D15~D0 October 25, 2007 ...
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... Package Information 8-pin DIP (300mil) Outline Dimensions Symbol Rev. 1.40 Dimensions in mil Min. Nom. 355 240 125 125 16 50 100 295 335 0 7 HT93LC66 Max. 375 260 135 145 20 70 315 375 15 October 25, 2007 ...
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... SOP (150mil) Outline Dimensions Symbol Rev. 1.40 Dimensions in mil Min. Nom. 228 149 14 189 HT93LC66 Max. 244 157 20 197 October 25, 2007 ...
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... TSSOP Outline Dimensions Symbol Rev. 1.40 Dimensions in mm Min. Nom. 1.05 0.05 0.95 0.25 0.11 2.90 6.20 4.30 0.65 0.50 0. HT93LC66 Max. 1.20 0.15 1.05 0.15 3.10 6.60 4.50 0.70 1.10 0.10 8 October 25, 2007 ...
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... Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness TSSOP 8L Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.40 Dimensions in mm 330 1.0 62 1.5 12.75+0.15 2.0 0.15 12.4+0.2 16.8 0.4 Dimensions in mm 330 1.0 62 1.5 13.0+0.5 0.2 2.0 0.5 12.8+0.3 0.2 18.2 0.2 10 HT93LC66 October 25, 2007 ...
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... Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) A0 Cavity Length B0 Cavity Width K0 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.40 Dimensions in mm 12.0+0.3 0.1 8.0 0.1 1.75 0.1 5.5 0.1 1.55 0.1 1.5+0.25 4.0 0.1 2.0 0.1 6.4 0.1 5.20 0.1 2.1 0.1 0.3 0.05 9.3 Dimensions in mm 12.0+0.3 0.1 8.0 0.1 1.75 0.1 5.5 0.5 1.5+0.1 1.5+0.1 4.0 0.1 2.0 0.1 7.0 0.1 3.6 0.1 1.6 0.1 0.3 0.013 9.3 11 HT93LC66 October 25, 2007 ...
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... Holtek s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.40 12 HT93LC66 October 25, 2007 ...