MADP-017025-1314 MA-COM [M/A-COM Technology Solutions, Inc.], MADP-017025-1314 Datasheet

MADP-017025-1314

Manufacturer Part Number

MADP-017025-1314

Description

Manufacturer

MA-COM [M/A-COM Technology Solutions, Inc.]

Datasheet

1.MADP-017025-1314.pdf (4 pages)

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ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

SURMOUNT™ 25µM PIN Diodes

RoHS Compliant

Features

♦

This device is a silicon, glass PIN diode surmount chip

fabricated with M/A-COM’s patented HMIC

This device features two silicon pedestals embedded in a

low loss, low dispersion glass. The diode is formed on the

top of one pedestal and connections to the backside of the

device are facilitated by making the pedestal sidewalls

electrically conductive. Selective backside metallization is

applied producing a surface mount device. This vertical

topology provides for exceptional heat transfer. The

topside is fully encapsulated with silicon nitride and has an

additional polymer layer for scratch and impact protection.

These protective coatings prevent damage to the junction

and the anode air-bridge during handling and assembly.

These packageless devices are suitable for usage in

moderate incident power, ≤50dBm/C.W. or where the peak

power is ≤75dBm, pulse width is 1µS, and duty cycle is

0.01%. Their low parasitic inductance, 0.4 nH, and

excellent RC constant, make these devices a superior

choice for higher frequency switch elements when

compared to their plastic package counterparts

1) Exceeding these limits may cause permanent damage

MADP-017025-1314

MADP-030025-1314

Absolute Maximum Ratings

(unless otherwise specified)

Forward Current

Reverse Voltage

Operating Temperature

Storage Temperature

Junction Temperature

C.W. Incident Power

Peak Incident Power (dBm)

Mounting Temperature

0603 Outline

Surface Mount

25µm I-Region Length Devices

No Wirebonds Required

Silicon Nitride Passivation

Polymer Scratch Protection

Low Parasitic Capacitance and Inductance

High Average and Peak Power Handling

Parameter

Applications

Description

+50 dBm, 10µS, 1% duty

+44dBm MADP-017025

+47dBM MADP-030025

+280°C for 30 seconds

Absolute Maximum

-55 °C to +150°C

-55°C to +125°C

@ TA = +25°C

500 mA

+175°C

- 135 V

process.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Notes:

1) Backside metal: 0.1microns thick.

2) Yellow area with hatch lines indicate backside ohmic gold

3) Both devices have same outline dimensions ( A to G).

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.4155721

DIM

contacts.

Visit www.macomtech.com for additional data sheets and product information.

0.060

0.031

0.004

0.019

0.029

Min

Case Style ODS 1314

Chip Dimensions

INCHES

0.062

0.032

0.008

0.021

0.031

Max

• China Tel: +86.21.2407.1588

1.525

0.775

0.102

0.475

0.725

Min

1.575

0.825

0.203

0.525

0.775

Max

Rev. V5

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MADP-017025-1314 Summary of contents

Page 1

... MADP-017025-1314 MADP-030025-1314 SURMOUNT™ 25µM PIN Diodes RoHS Compliant Features ♦ 0603 Outline ♦ Surface Mount ♦ 25µm I-Region Length Devices ♦ No Wirebonds Required ♦ Silicon Nitride Passivation ♦ Polymer Scratch Protection ♦ Low Parasitic Capacitance and Inductance ♦ High Average and Peak Power Handling ...

Page 2

... T Au/Sn solder. MADP-0XX025 Series Typical Spice Parameters @ +25°C Spice Parameter N Units - MADP-017025-1314 1.1 MADP-030025-1314 1.1 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development ...

Page 3

... MADP-017025-1314 MADP-030025-1314 SURMOUNT™ 25µM PIN Diodes RoHS Compliant MADP-0XXX15 Series Typical Performance Curves @ +25°C Ct vs. V 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 MADP-017025 0.10 0. Voltage (V) Ct vs. Freq. 0.8 0.7 0V 0.6 10V 0.5 40V 0.4 0V 0.3 10V 0.2 40V 0.1 MADP-17025 0 0 0.2 0.4 0.6 0.8 1 Frequency (GHz) Rs vs. Freq. 1.6 MADP-017025 1 1.2 10mA 1.0 20mA 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development ...

Page 4

... M541 Bonding and Handling Procedures Ordering Information Part Number Package MADP-017025-13140G 100 piece gel pack MADP-017025-13140P 3000 piece reel MADP-030025-13140G 100 piece gel pack MADP-030025-13140P 3000 piece reel • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 Visit www ...

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