MA4P1200-401T MA-COM [M/A-COM Technology Solutions, Inc.], MA4P1200-401T Datasheet - Page 12

• Manufacturer Part Number: MA4P1200-401T
• Description: High Power PIN Diodes
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

12
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
High Power PIN Diodes
♦
♦
♦
Axial leaded diodes are available in tape and reel or bulk in quantities as shown in table below
HIPAX PIN diodes are designed to meet most environmental and electrical requirements and may be ordered
screened to MIL-STD-750 specifications as described in the table below.
Note:
MA4P HIPAX
Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming the
bend no closer than .060 inches from the body of the part. Bending the lead < 0.060 inches from the body of the part
is not recommended and may cause internal damage to the chip. Appropriate fixturing should be used.
Devices may be soldered using standard 60Sn/40Pb or any RoHS compliant solders. Axial leads are tin plated 50μm
thick to ensure an optimum connection.
For recommended Sn/Pb and RoHS soldering profiles See Application Note
1.Test applicable to HIPAX axially leaded devices only.
High Temperature Storage
.060” Min
Constant Acceleration
Moisture Resistance
Temperature Shock
Minimum Bend Distance
Package Style
Lead Fatigue
Case Style 401 & 402
Solderability
Fine Leak
Tension
HTRB
401T
TEST
402
1
Axial Leaded HIPAX Assembly Recommendations
1
™
.060” Min
Environmental Ratings
Ordering Information
2036.3 Cond. A
2036.3 Cond. E
1071 Cond. H
Quantity Per Reel
METHOD
1021
1031
1038
1051
2006
2026
500
N/A
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: [phone] • Europe Tel: [phone]
• India Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Cathode Band
Internal Construction
85°C, 85% Relative Humidity, 168 hrs
Case Style 401 & 402
M538
80% of rated V
DESCRIPTION/ CONDITIONS
-65°C to +175°C, 20 Cycles
on the M/A-COM website.
IPC/JDEC J-STD-02
3 Cycles, 8 oz., 90°,
+175°C , 250 Hours
2 Lbs., 30 Seconds
Bulk Devices Per Bag
1 X 10
20,000 G’s
• China Tel: [phone]
-7
R
, 50°C, 96 Hours
CC/Sec
N/A
100
Passivated Chip
V9