MA4SW310 MA-COM [M/A-COM Technology Solutions, Inc.], MA4SW310 Datasheet
MA4SW310
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MA4SW310 Summary of contents
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... Comparable pHempt Designs ♦ Rugged Fully Monolithic, Glass Encapsulated Chip with Polymer Protection Coating ♦ +30dBm C.W. Power Handling @ +25°C Description The MA4SW110, MA4SW210 and MA4SW310 are broadband monolithic switches using series and shunt connected silicon PIN diodes. They are designed for ...
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... Signal Compression (500mW) MA4SW210 (SPDT) Electrical Specifications @ T A Parameter Insertion Loss Isolation Input Return Loss 1 Switching Speed 2 Voltage Rating Signal Compression (500mW) MA4SW310 (SP3T) Electrical Specifications @ T A Parameter Insertion Loss Isolation Input Return Loss 1 Switching Speed 2 Voltage Rating Signal Compression (500mW) 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development ...
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... M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW110 INSERTION LOSS vs. FREQUENCY - FREQUENCY (GHz) MA4SW210 INSERTION LOSS vs. FREQUENCY - FREQUENCY (GHz) MA4SW310 INSERTION LOSS vs. FREQUENCY - FREQUENCY (GHz) Rev ...
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... FREQUENCY (GHz) MA4SW210 ISOLATION vs. FREQUENCY -35 -40 -45 -50 -55 -60 -65 -70 -75 - FREQUENCY (GHz) MA4SW310 ISOLATION vs. FREQUENCY -35 -40 -45 -50 -55 -60 -65 -70 -75 - FREQUENCY (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...
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... J1 RF INPUT 20pF J2 BIAS J3 BIAS 20nH 100Ω 20pF 20pF 20pF 20nH 20nH 20pF J2 RF OUTPUT 20pF Switch Chip MA4SW310 and Bias Connections J1 RF INPUT 20pF J4 BIAS J2 BIAS 20nH 20pF 100Ω 20nH 20pF 20pF 20nH 20pF J2 RF OUTPUT 20pF J3 BIAS ...
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... MA4SW110 MA4SW210 MA4SW310 HMIC™ Silicon PIN Diode Switches RoHS Compliant Wire Bonding Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A heat stage temperature of 150 necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires should be kept as short as possible ...
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... MA4SW110 MA4SW210 MA4SW310 HMIC™ Silicon PIN Diode Switches RoHS Compliant MA4SW210 Chip Outline Drawing DIM Notes: 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...
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... MA4SW110 MA4SW210 MA4SW310 HMIC™ Silicon PIN Diode Switches RoHS Compliant MA4SW310 Chip Outline Drawing DIM Notes: 8 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...