IC 3IN AND GATE TRIPLE 14SOIC

HEF4073BT,653

Manufacturer Part NumberHEF4073BT,653
DescriptionIC 3IN AND GATE TRIPLE 14SOIC
ManufacturerNXP Semiconductors
Series4000B
HEF4073BT,653 datasheets
 


Specifications of HEF4073BT,653

Number Of Circuits3Package / Case14-SOIC (3.9mm Width), 14-SOL
Logic TypeAND GateNumber Of Inputs3
Current - Output High, Low2.4mA, 2.4mAVoltage - Supply4.5 V ~ 15.5 V
Operating Temperature-40°C ~ 125°CMounting TypeSurface Mount
ProductANDLogic FamilyHEF4000
High Level Output Current- 3.6 mALow Level Output Current3.6 mA
Propagation Delay Time20 nsSupply Voltage (max)15.5 V
Supply Voltage (min)3 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMTMinimum Operating Temperature- 40 C
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names933373040653
HEF4073BTD-T
HEF4073BTD-T
1
2
3
4
5
6
7
8
9
10
11
Page 11
12
Page 12
13
Page 13
14
Page 14
15
Page 15
16
Page 16
17
Page 17
18
Page 18
19
Page 19
20
Page 20
21
22
23
24
25
26
Page 18/26

Download datasheet (180Kb)Embed
PrevNext
Philips Semiconductors
Package information
DIP24: plastic dual in-line package; 24 leads (600 mil)
L
Z
24
pin 1 index
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
1
2
UNIT
b
max.
min.
max.
1.7
mm
5.1
0.51
4.0
1.3
0.066
inches
0.20
0.020
0.16
0.051
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT101-1
051G02
January 1995
D
A
1
e
w
M
b
1
b
13
12
0
5
10 mm
scale
(1)
(1)
b
c
D
E
e
1
0.53
0.32
32.0
14.1
2.54
0.38
0.23
31.4
13.7
0.021
0.013
1.26
0.56
0.10
0.015
0.009
1.24
0.54
REFERENCES
JEDEC
EIAJ
MO-015AD
18
Package outlines
M
E
A
2
A
c
(e )
1
M
H
E
e
L
M
M
1
E
H
3.9
15.80
17.15
15.24
0.25
3.4
15.24
15.90
0.15
0.62
0.68
0.60
0.01
0.13
0.60
0.63
EUROPEAN
ISSUE DATE
PROJECTION
92-11-17
95-01-23
SOT101-1
(1)
Z
w
max.
2.2
0.087