HEF4030BT,653 NXP Semiconductors, HEF4030BT,653 Datasheet

IC EX-OR GATE QUAD 14SOIC

HEF4030BT,653

Manufacturer Part Number
HEF4030BT,653
Description
IC EX-OR GATE QUAD 14SOIC
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheets
1.HEF4046BT652.pdf (26 pages)
2.HEF4030BT652.pdf (3 pages)

Specifications of HEF4030BT,653

Logic Type
XOR (Exclusive OR)
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
2.4mA, 2.4mA
Voltage - Supply
4.5 V ~ 15.5 V
Operating Temperature
-20°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Logic Family
4000
Logical Function
XOR
Number Of Elements
4
High Level Output Current
-3.6mA
Low Level Output Current
3.6mA
Propagation Delay Time
55ns
Operating Supply Voltage (typ)
3.3/5/9/12V
Operating Temp Range
-40C to 85C
Package Type
SO
Number Of Outputs
1
Technology
CMOS
Mounting
Surface Mount
Pin Count
14
Operating Temperature Classification
Industrial
Quiescent Current
4uA
Operating Supply Voltage (max)
15V
Operating Supply Voltage (min)
3V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
933372820653
HEF4030BTD-T
HEF4030BTD-T
INTEGRATED CIRCUITS
DATA SHEET
Package outlines
Package information
January 1995
File under Integrated Circuits, IC04

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HEF4030BT,653 Summary of contents

Page 1

DATA SHEET Package outlines Package information File under Integrated Circuits, IC04 INTEGRATED CIRCUITS January 1995 ...

Page 2

Philips Semiconductors Package information INDEX PACKAGE VERSIONS SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm SOT109-1 plastic small outline package; 16 leads; body width 3.9 mm SOT162-1 plastic small outline package; 16 leads; body width 7.5 ...

Page 3

Philips Semiconductors Package information SO SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 4

Philips Semiconductors Package information SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 5

Philips Semiconductors Package information SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 6

Philips Semiconductors Package information SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 7

Philips Semiconductors Package information SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 8

Philips Semiconductors Package information SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 9

Philips Semiconductors Package information SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 10

Philips Semiconductors Package information SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 11

Philips Semiconductors Package information SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 12

Philips Semiconductors Package information SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 13

Philips Semiconductors Package information SSOP28: plastic shrink small outline package; 28 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 14

Philips Semiconductors Package information DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. ...

Page 15

Philips Semiconductors Package information DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. ...

Page 16

Philips Semiconductors Package information DIP18: plastic dual in-line package; 18 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 17

Philips Semiconductors Package information DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 18

Philips Semiconductors Package information DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 19

Philips Semiconductors Package information DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

Page 20

Philips Semiconductors Package information DIP40: plastic dual in-line package; 40 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 21

Philips Semiconductors Package information CDIP handbook, full pagewidth 3.4 2.9 2.54 max 14 1 Dimensions in mm. Ceramic dual in-line package; 14 leads; glass seal (CDIP14; SOT73-1). January 1995 19.94 max 5.08 max 0.51 min 0.254 M 2.54 0.51 (12x) ...

Page 22

Philips Semiconductors Package information 1/1 page = 296 mm (Datasheet) 3.4 2.9 1.27 max 16 1 Dimensions in mm. Ceramic dual in-line package; 16 leads; glass seal (CDIP16; SOT74-1). January 1995 19.94 max 0.51 min 0.254 2.54 0.51 (14x) 0.38 ...

Page 23

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 1.27 max 18 1 Dimensions in mm. Ceramic dual in-line package; 18 leads; glass seal (CDIP18; SOT133-1). January 1995 23.6 max 0.51 min 0.254 2.54 0.51 (16x) 0.38 1 ...

Page 24

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 1.27 max 20 1 Dimensions in mm. Ceramic dual in-line package; 20 leads; glass seal (CDIP20; SOT152-2). January 1995 25.4 max 0.51 min 0.254 2.54 0.51 (18x) 0.38 1 ...

Page 25

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 2.54 max 24 1 Dimensions in mm. Ceramic dual in-line package; 24 leads; glass seal (CDIP24; SOT94-1). January 1995 33 max 0.51 min 0.254 M 2.54 0.58 (22x) 0.38 1.7 max ...

Page 26

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 2.54 max 28 1 Dimensions in mm. Ceramic dual in-line package; 28 leads; glass seal (CDIP28; SOT135-1). January 1995 38.1 max 0.58 2.54 0.38 (26x) 1.7 max Package ...

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