UPD43256BGW-B12-9JL NEC [NEC], UPD43256BGW-B12-9JL Datasheet - Page 21

• Manufacturer Part Number: UPD43256BGW-B12-9JL
• Description: 256K-BIT CMOS STATIC RAM 32K-WORD BY 8-BIT
• Manufacturer: NEC [NEC]

Recommended Soldering Conditions
document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E).
different conditions.
Types of Surface Mount Device
Types of Through Hole Mount Device
Caution Do not jet molten solder on the surface of package.
Please consult with our sales offices.
Wave soldering (only to leads)
Partial heating method
The following conditions (See table below) must be met when soldering PD43256B. For more details, refer to our
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
PD43256BGU-xxL
PD43256BGU-xxLL
PD43256BGU-Axx
PD43256BGU-Bxx
PD43256BGW-xxLL-9JL
PD43256BGW-xxLL-9KL
PD43256BGW-Axx-9JL
PD43256BGW-Axx-9KL
PD43256BGW-Bxx-9JL
PD43256BGW-Bxx-9KL
PD43256BCZ-xxL
PD43256BCZ-xxLL
Soldering process
: 28-PIN PLASTIC DIP (15.24 mm (600))
: 28-PIN PLASTIC DIP (15.24 mm (600))
: 28-PIN PLASTIC SOP (11.43 mm (450))
: 28-PIN PLASTIC SOP (11.43 mm (450))
: 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent)
: 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent)
: 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent)
: 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent)
: 28-PIN PLASTIC SOP (11.43 mm (450))
: 28-PIN PLASTIC SOP (11.43 mm (450))
: 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent)
: 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent)
Data Sheet M10770EJCV0DS00
Solder temperature : 260 C or below,
Flow time : 10 seconds or below
Terminal temperature : 300 C or below,
Time : 3 seconds or below (Per one lead)
Soldering conditions
PD43256B
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