em658160ts-8 Etron Technology Inc., em658160ts-8 Datasheet

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em658160ts-8

Manufacturer Part Number
em658160ts-8
Description
Synchronous Dram Sdram
Manufacturer
Etron Technology Inc.
Datasheet
EtronT ech
Etron Confidential
double data rate synchronous DRAM containing 64
Mbits. It is internally configured as a quad 1M x 16
DRAM with a synchronous interface (all signals are
registered on the positive edge of the clock signal, CK).
Data outputs occur at both rising edges of CK and /CK.
Read and write accesses to the SDRAM are burst
oriented; accesses start at a selected location and
continue for a programmed number of locations in a
programmed sequence. Accesses begin with the
registration of a BankActivate command which is then
followed by a Read or Write command. The EM658160
provides programmable Read or Write burst lengths of 2,
4, 8, full page.
Etron Technology, Inc.
No. 6, Technology Rd. V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C.
TEL: (886)-3-5782345
Etron Technology, Inc., reserves the right to make changes to its products and specifications without notice.
Features
• Fast clock rate: 300/285/250/200/166/143/125MHz
• Differential Clock CK & /CK
• Bi-directional DQS
• DLL enable/disable by EMRS
• Fully synchronous operation
• Internal pipeline architecture
• Four internal banks, 1M x 16-bit for each bank
• Programmable Mode and Extended Mode registers
• Individual byte write mask control
• DM Write Latency = 0
• Auto Refresh and Self Refresh
• 4096 refresh cycles / 64ms
• Precharge & active power down
• Power supplies: V
• Interface: SSTL_2 I/O Interface
• Package: 66 Pin TSOP II, 0.65mm pin pitch
Ordering Information
Overview
EM658160TS-3.3
EM658160TS-3.5
EM658160TS-4
EM658160TS-5
EM658160TS-6
EM658160TS-7
EM658160TS-8
- /CAS Latency: 2, 2.5, 3
- Burst length: 2, 4, 8
- Burst Type: Sequential & Interleaved
The EM658160 SDRAM is a high-speed CMOS
Part Number
V
DD
DDQ
Frequency
300MHz
285MHz
250MHz
200MHz
166MHz
143MHz
125MHz
= 3.3V ± 0.3V
= 2.5V ± 0.2V
FAX: (886)-3-5778671
4M x 16 DDR Synchronous DRAM (SDRAM)
Package
TSOP II
TSOP II
TSOP II
TSOP II
TSOP II
TSOP II
TSOP II
provide a self-timed row precharge that is initiated at the
end of the burst sequence. The refresh functions, either
Auto or Self Refresh are easy to use.
EM658160 features programmable DLL option. By
having a programmable mode register and extended
mode register, the system can choose the most suitable
modes to maximize its performance. These devices are
well suited for applications requiring high memory
bandwidth, result in a device particularly well suited to
high
applications.
An auto precharge function may be enabled to
Pin Assignment (Top View)
performance
A10/AP
VDDQ
VDDQ
VDDQ
LDQS
VSSQ
VSSQ
/CAS
/RAS
VDD
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
VDD
LDM
VDD
BS0
BS1
/WE
/CS
NC
NC
NC
NC
A0
A1
A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
main
(Rev. 1.1 Jan./2002)
memory
EM658160
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
and
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
NC
VSSQ
UDQS
NC
VREF
VSS
UDM
/CK
CK
CKE
NC
NC
A11
A9
A8
A7
A6
A5
A4
VSS
In addition,
graphics

Related parts for em658160ts-8

em658160ts-8 Summary of contents

Page 1

... EM658160TS-5 200MHz EM658160TS-6 166MHz EM658160TS-7 143MHz EM658160TS-8 125MHz Overview The EM658160 SDRAM is a high-speed CMOS double data rate synchronous DRAM containing 64 Mbits internally configured as a quad DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CK). ...

Page 2

Et ronT ech Block Diagram DLL CK CLOCK /CK BUFFER CKE /CS COMMAND /RAS /CAS DECODER /WE COLUMN COUNTER A10/AP ADDRESS A0 BUFFER A11 BS0 BS1 REFRESH COUNTER DATA LDQS, STROBE UDQS BUFFER DQ0 D DQ15 Etron Confidential 4Mx16 DDR ...

Page 3

Et ronT ech Pin Descriptions Symbol Type CK, /CK Input Differential Clock: CK, /CK are driven by the system clock. All SDRAM input signals are sampled on the positive edge of CK. Both CK and /CK increment the internal burst ...

Page 4

Et ronT ech Supply Power Supply: +3.3V ±0. Supply Ground SS Supply DQ Power: +2.5V ±0.2V. Provide isolated power to DQs for improved noise immunity. V DDQ V Supply DQ Ground: Provide isolated ground to DQs for ...

Page 5

Et ronT ech Operation Mode Fully synchronous operations are performed to latch the commands at the positive edges of CK. Table 2 shows the truth table for the operation commands. Command BankActivate BankPrecharge PrechargeAll Write Write and AutoPrecharge Read Read ...

Page 6

Et ronT ech Mode Register Set (MRS) The mode register is divided into various fields depending on functionality. • Burst Length Field (A2~A0) This field specifies the data length of column access using the A2~A0 pins and selects the Burst ...

Page 7

Et ronT ech • CAS Latency Field (A6~A4) This field specifies the number of clock cycles from the assertion of the Read command to the first read data. The minimum whole value of CAS Latency depends on the frequency of ...

Page 8

Et ronT ech Absolute Maximum Rating Symbol Input, Output Voltage IN OUT Power Supply Voltage DD DDQ T Operating Temperature OPR T Storage Temperature STG T Soldering Temperature (10s) SOLDER P Power Dissipation D ...

Page 9

Et ronT ech = 3.3V 1MHz °C) Capacitance (V DD Symbol Parameter C Input Capacitance (except for CK pin) IN Input Capacitance (CK pin) C DQ, DQS, DM Capacitance I/O Note: These parameters are periodically ...

Page 10

Et ronT ech Electrical Characteristics and Recommended A.C. Operating Conditions = 3.3 ± 0 0~70 ° Symbol Parameter t Row cycle time RC t Refresh row cycle time RFC t Row active time RAS t ...

Page 11

Et ronT ech Note: 1. Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. 2. All voltages are referenced These parameters depend on the cycle rate and these values are ...

Page 12

Et ronT ech Timing Waveforms Figure 1. AC Parameters for Read Timing / CMD Read ADDR /CS DQS DQ Etron Confidential 4Mx16 DDR SDRAM (Burst Length=4, CAS ...

Page 13

Et ronT ech Figure 2. AC Parameters for Write Timing CK /CK CMD ADDR /CS DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Length=4) Write WPRES DSH t DSL t ...

Page 14

Et ronT ech Figure 3. Read Command to Output Data Latency CK /CK CMD Read CL=2 DQ DQS CL=2.5 DQ DQS CL=3 DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Length=2) DA1 DA0 Postamble Preamble DA0 DA1 Postamble Preamble DA1 ...

Page 15

Et ronT ech Figure 4. Read Followed by Write CK /CK t RRD t RCDR Activate Read CMD ACT ADDR Row/Bank0 Col/Bank0 Rol/Bank1 /CS DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Lenth=4, CAS Latency=3) Write Col/Bank0 ...

Page 16

Et ronT ech Figure 5. Write followed by Read CK /CK Write CMD Col ADDR / DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Lenth=4, CAS Latency=3) t WTR Read Col ...

Page 17

Et ronT ech Figure 6. Precharge Termination of a Burst Read CK /CK CMD Read ADDR /CS DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Length=4, CAS Latency=3) Precharge Bank Col t RP Preamble 17 EM658160 ACT Bank D1 D0 ...

Page 18

Et ronT ech Figure 7. Precharge Termination of a Burst Write CK /CK Activate Write CMD ADDR Row/Bank Col/Bank /CS t RCD DQM DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Length= Precharge Activate Row/Bank Row/Bank t t ...

Page 19

Et ronT ech Figure 8. Auto Precharge after Read Burst CK / BL=2 Auto Precharge CMD ReadA DQ Auto Precharge BL=4 CMD ReadA DQ BL=8 CMD ReadA DQ Etron Confidential 4Mx16 DDR SDRAM (CAS Latency=3) ACT D0 D1 ...

Page 20

Et ronT ech Figure 9. Auto Precharge after Write Burst CK /CK BL=2 WriteA Auto Precharge CMD Preamble DQS Postamble WriteA BL=4 CMD Preamble DQS Postamble BL=8 WriteA CMD ...

Page 21

Et ronT ech Figure 10. Read Terminated By Burst Stop CK /CK Read CMD Col ADDR /CS CL=3 DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Length=8) BST EM658160 Rev. 1.1 Jan. 2002 ...

Page 22

Et ronT ech Figure 11. Read Terminated by Read CK /CK t CCD CMD Read Read ADDR Col A Col B /CS DQ DQS Etron Confidential 4Mx16 DDR SDRAM (Burst Length=4, CAS Latency=3) DA1 DA0 DB0 DB1 22 Rev. 1.1 ...

Page 23

Et ronT ech Figure 12. Mode Register Set Command CK /CK t CMD Precharge ADDR /CS Etron Confidential 4Mx16 DDR SDRAM 1 clk RP MRS ACT Row MRS Data 23 EM658160 Rev. 1.1 Jan. 2002 ...

Page 24

Et ronT ech Figure 13. Active / Precharge Power Down Mode CK / CKE CMD Activate / Precharge Note 1,2 Note: 1. All banks should be in idle state prior to entering precharge power down mode. 2. One ...

Page 25

Et ronT ech Figure 14. Self Refresh Entry and Exit Cycle CK /CK Self Refresh Enter Auto CMD Refresh CKE t IS Self Refresh Exit t is required before any command can be applied, RC and 200 cycles of clk ...

Page 26

Et ronT ech 66 Pin TSOP II Package Outline Drawing Information Units: mm 22.22 0. 0.65 TYP 0.71 TYP Etron Confidential 4Mx16 DDR SDRAM 34 33 0.30 0.08 26 EM658160 + 0.085 0.125 - 0.005 ...

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