UPD4701AGT NEC [NEC], UPD4701AGT Datasheet - Page 13

• Manufacturer Part Number: UPD4701AGT
• Description: MOS INTEGRATED CIRCUIT
• Manufacturer: NEC [NEC]

RECOMMENDED SOLDERING CONDITIONS
different conditions.
TYPES OF SURFACE MOUNT DEVICE
TYPE OF THROUGH HOLE MOUNT DEVICE
PD4701AGT
PD4701AC
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
Infrared ray reflow
VPS
Wave soldering
Partial heating method
* Exposure limit before soldering after dry-pack package is opened.
Note Do not apply more than a single process at once, except for “Partial heating method”.
Wave soldering
Storage conditions: 25 C and relative humidity at 65 % or less.
Soldering process
Soldering process
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300 C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Solder temperature: 260 C or below,
Flow time: 10 seconds or below
Soldering conditions
Soldering conditions
PD4701A
WS60-00-1
VP15-00-2
IR35-00-2
Symbol
Symbol
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