IC DUAL 4INPUT NOR GATE 14-DIP

HEF4002BP,652

Manufacturer Part NumberHEF4002BP,652
DescriptionIC DUAL 4INPUT NOR GATE 14-DIP
ManufacturerNXP Semiconductors
Series4000B
HEF4002BP,652 datasheets
 


Specifications of HEF4002BP,652

Number Of Circuits2Package / Case14-DIP (0.300", 7.62mm)
Logic TypeNOR GateNumber Of Inputs4
Current - Output High, Low2.4mA, 2.4mAVoltage - Supply4.5 V ~ 15.5 V
Operating Temperature-40°C ~ 125°CMounting TypeThrough Hole
ProductNORLogic FamilyHEF4000
High Level Output Current- 3.6 mALow Level Output Current3.6 mA
Propagation Delay Time20 nsSupply Voltage (max)15.5 V
Supply Voltage (min)3 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMTMinimum Operating Temperature- 40 C
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names933277580652
HEF4002BPN
HEF4002BPN
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INTEGRATED CIRCUITS
DATA SHEET
Package outlines
Package information
January 1995
File under Integrated Circuits, IC04

HEF4002BP,652 Summary of contents

  • Page 1

    DATA SHEET Package outlines Package information File under Integrated Circuits, IC04 INTEGRATED CIRCUITS January 1995 ...

  • Page 2

    Philips Semiconductors Package information INDEX PACKAGE VERSIONS SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm SOT109-1 plastic small outline package; 16 leads; body width 3.9 mm SOT162-1 plastic small outline package; 16 leads; body width 7.5 ...

  • Page 3

    Philips Semiconductors Package information SO SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 4

    Philips Semiconductors Package information SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 5

    Philips Semiconductors Package information SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 6

    Philips Semiconductors Package information SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 7

    Philips Semiconductors Package information SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 8

    Philips Semiconductors Package information SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 9

    Philips Semiconductors Package information SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

  • Page 10

    Philips Semiconductors Package information SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

  • Page 11

    Philips Semiconductors Package information SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

  • Page 12

    Philips Semiconductors Package information SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

  • Page 13

    Philips Semiconductors Package information SSOP28: plastic shrink small outline package; 28 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

  • Page 14

    Philips Semiconductors Package information DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. ...

  • Page 15

    Philips Semiconductors Package information DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. ...

  • Page 16

    Philips Semiconductors Package information DIP18: plastic dual in-line package; 18 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

  • Page 17

    Philips Semiconductors Package information DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

  • Page 18

    Philips Semiconductors Package information DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

  • Page 19

    Philips Semiconductors Package information DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

  • Page 20

    Philips Semiconductors Package information DIP40: plastic dual in-line package; 40 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

  • Page 21

    Philips Semiconductors Package information CDIP handbook, full pagewidth 3.4 2.9 2.54 max 14 1 Dimensions in mm. Ceramic dual in-line package; 14 leads; glass seal (CDIP14; SOT73-1). January 1995 19.94 max 5.08 max 0.51 min 0.254 M 2.54 0.51 (12x) ...

  • Page 22

    Philips Semiconductors Package information 1/1 page = 296 mm (Datasheet) 3.4 2.9 1.27 max 16 1 Dimensions in mm. Ceramic dual in-line package; 16 leads; glass seal (CDIP16; SOT74-1). January 1995 19.94 max 0.51 min 0.254 2.54 0.51 (14x) 0.38 ...

  • Page 23

    Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 1.27 max 18 1 Dimensions in mm. Ceramic dual in-line package; 18 leads; glass seal (CDIP18; SOT133-1). January 1995 23.6 max 0.51 min 0.254 2.54 0.51 (16x) 0.38 1 ...

  • Page 24

    Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 1.27 max 20 1 Dimensions in mm. Ceramic dual in-line package; 20 leads; glass seal (CDIP20; SOT152-2). January 1995 25.4 max 0.51 min 0.254 2.54 0.51 (18x) 0.38 1 ...

  • Page 25

    Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 2.54 max 24 1 Dimensions in mm. Ceramic dual in-line package; 24 leads; glass seal (CDIP24; SOT94-1). January 1995 33 max 0.51 min 0.254 M 2.54 0.58 (22x) 0.38 1.7 max ...

  • Page 26

    Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 2.54 max 28 1 Dimensions in mm. Ceramic dual in-line package; 28 leads; glass seal (CDIP28; SOT135-1). January 1995 38.1 max 0.58 2.54 0.38 (26x) 1.7 max Package ...