cp341 Central Semiconductor Corp., cp341 Datasheet
cp341
Manufacturer Part Number
cp341
Description
Small Signal Transistors
Manufacturer
Central Semiconductor Corp.
Datasheet
1.CP341.pdf
(2 pages)
PROCESS DETAILS
GEOMETRY
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel:
Fax: (631) 435-1824
www.centralsemi.com
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
(631) 435-1110
Epitaxial Planar
18 x 18 MILS
7.1 MILS
3.8 x 3.8 MILS
3.8 x 3.8 MILS
Al/Si - 30,000A
Au - 12,000A
NPN - Low V CE(SAT) Transistor Chip
GROSS DIE PER 5 INCH WAFER
PROCESS
PRINCIPAL DEVICE TYPES
Small Signal Transistors
CMLT3410
CMPT3410
CMST3410
CMUT3410
CXT3410
54,330
R1 (10- April 2007)
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cp341 Summary of contents
Page 1
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS Small Signal Transistors ...
Page 2
... Central Central TM TM Semiconductor Corp. Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS Typical Electrical Characteristics CP341V R1 (10- April 2007) ...