UPD75238GJ NEC [NEC], UPD75238GJ Datasheet - Page 184

• Manufacturer Part Number: UPD75238GJ
• Description: 4 BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC [NEC]

184
14. RECOMMENDED SOLDERING CONDITIONS
under different conditions.
WS60-107-1
IR30-107-1
VP15-107-1
Partial heating
method
Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and
The following conditions must be met when soldering the PD75238.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
Caution Do not apply more than a single process at a time, except for “Partial heating method.”
Remark For more details, refer to our document “SMT MANUAL” (IEI-1207).
PD75238GJ-
Symbol
relative humidity at 65 % or less.
Part number
-5BG
Wave soldering
Infrared ray reflow
VPS
Partial heating method
Soldering process
Table 14-1 Recommended Soldering Conditions
Table 14-2 Soldering Conditions
94-pin plastic QFP
Temperature in the soldering vessel: 260 ˚C or below
Soldering time: 10 seconds or less
Number of soldering processes: 1
Exposure limit: 7 days
Pre-heating temperature: 120 ˚C max.
Peak package’s surface temperature: 230 ˚C
Reflow time: 30 seconds or less (at 210 ˚C or higher)
Number of reflow processes: 1
Exposure limit: 7 days
Peak package’s surface temperature: 215 ˚C
Reflow time: 40 seconds or less (at 200 ˚C or higher)
Number of reflow processes: 1
Exposure limit: 7 days
Terminal temperature: 300 ˚C or below
Flow time: 3 seconds or less (one side per device)
Package
(10 hours of pre-baking is required at 125 ˚C afterward.)
(package surface temperature)
(10 hours of pre-baking is required at 125 ˚C afterward.)
(10 hours of pre-baking is required at 125 ˚C afterward.)
Soldering conditions
Note
Note
Note
WS60-107-1
IR30-107-1
VP15-107-1
Partial heating method
Symbol
PD75238