IC HEX INVERTER 14-TSSOP

HEF4069UBTT,112

Manufacturer Part NumberHEF4069UBTT,112
DescriptionIC HEX INVERTER 14-TSSOP
ManufacturerNXP Semiconductors
Series4000B
HEF4069UBTT,112 datasheet
 

Specifications of HEF4069UBTT,112

Logic TypeInverterNumber Of Inputs1
Number Of Circuits6Current - Output High, Low4.2mA, 4.2mA
Voltage - Supply3 V ~ 15 VOperating Temperature-40°C ~ 125°C
Mounting TypeSurface MountPackage / Case14-TSSOP
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names935283025112
HEF4069UBTT
HEF4069UBTT
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HEF4069UB
Hex inverter
Rev. 06 — 8 December 2009
1. General description
The HEF4069UB is a general purpose hex inverter. Each inverter has a single stage.
It operates over a recommended V
(usually ground). Unused inputs must be connected to V
It is also suitable for use over both the industrial (−40 °C to +85 °C) and automotive
(−40 °C to +125 °C) temperature ranges.
2. Features
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Operates across the automotive temperature range from −40 °C to +125 °C
Complies with JEDEC standard JESD 13-B
3. Applications
Automotive and industrial
Oscillator
4. Ordering information
Table 1.
Ordering information
°
All types operate from
40
C to +125
Type number
Package
Name
Description
HEF4069UBP
DIP14
plastic dual in-line package; 14 leads (300 mil)
HEF4069UBT
SO14
plastic small outline package; 14 leads; body width 3.9 mm
HEF4069UBTT
TSSOP14
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
power supply range of 3 V to 15 V referenced to V
DD
°
C.
Product data sheet
SS
, V
, or another input.
DD
SS
Version
SOT27-1
SOT108-1
SOT402-1

HEF4069UBTT,112 Summary of contents

  • Page 1

    HEF4069UB Hex inverter Rev. 06 — 8 December 2009 1. General description The HEF4069UB is a general purpose hex inverter. Each inverter has a single stage. It operates over a recommended V (usually ground). Unused inputs must be connected to ...

  • Page 2

    ... NXP Semiconductors 5. Functional diagram 001aag152 Fig 1. Functional diagram 6. Pinning information 6.1 Pinning Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin 11 10 HEF4069UB_6 Product data sheet Fig 2. Schematic diagram (one inverter HEF4069UB 001aag153 Description input output ground (0 V) supply voltage Rev. 06 — ...

  • Page 3

    ... NXP Semiconductors 7. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage I I output clamping current OK I input/output current I/O I supply current DD T storage temperature stg ...

  • Page 4

    ... NXP Semiconductors 9. Static characteristics Table 5. Static characteristics unless otherwise specified Symbol Parameter Conditions |I | < 1 μA V HIGH-level IH O input voltage |I | < 1 μA V LOW-level IL O input voltage |I | < 1 μA V HIGH-level OH O output voltage |I | < 1 μA V LOW-level OL O output voltage I HIGH-level output current ...

  • Page 5

    ... NXP Semiconductors 10. Dynamic characteristics Table 6. Dynamic characteristics ° for waveforms see Figure amb Symbol Parameter Conditions t HIGH to LOW nA to nY; PHL propagation delay t LOW to HIGH PLH propagation delay t HIGH to LOW output output nY THL transition time t LOW to HIGH output output nY TLH transition time ...

  • Page 6

    ... NXP Semiconductors 11. Waveforms Measurement points 0.5V M Logic levels: V and V are typical output voltage levels that occur with the output load Fig 4. Propagation delay and transition times Definitions for test circuit load capacitance including jig and probe capacitance termination resistance should be equal to the output impedance Z ...

  • Page 7

    ... NXP Semiconductors 11.1 Transfer characteristics 5 (V) 2.5 ( output voltage drain current. D Fig 6. Typical transfer characteristics HEF4069UB_6 Product data sheet 001aag159 500 (μA) (V) 250 (V) 10 (2) (1) ( Rev. 06 — 8 December 2009 HEF4069UB Hex inverter 001aag160 (2) ( 001aag161 (mA (V) I © NXP B.V. 2009. All rights reserved. ...

  • Page 8

    ... NXP Semiconductors 12. Application information Some examples of applications for the HEF4069UB. Figure 7 shows an astable relaxation oscillator using two HEF4069UB inverters and 2 BAW62 diodes. The oscillation frequency is mainly determined by R1 × C1, provided R1 << R2 and R2 × C2 << R1 × C1. The function minimize the influence of the forward voltage across the protection diodes on the frequency ...

  • Page 9

    ... NXP Semiconductors Figure 8 shows a crystal oscillator for frequencies MHz using two HEF4069UB inverters.The second inverter amplifies the oscillator output voltage to a level sufficient to drive other Local Oxidation CMOS (LOCMOS) circuits. The output inverter is used to amplify the oscillator output voltage to a level sufficient to drive other LOCMOS circuits. ...

  • Page 10

    ... NXP Semiconductors Figure (mA/V) (1) 7.5 (2) 5.0 (3) 2 (1) Average. (2) Average +2σ; where: ‘σ’ is the standard deviation. (3) Average −2σ; where: ‘σ’ is the standard deviation. Fig 12. Typical forward transconductance as a function of supply voltage at T HEF4069UB_6 Product data sheet shows typical forward transconductance and 001aag164 0.47 μ ...

  • Page 11

    ... NXP Semiconductors 13. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. 1.73 mm 4.2 0.51 3.2 1.13 0.068 inches 0.17 0.02 0.13 0.044 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...

  • Page 12

    ... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

  • Page 13

    ... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

  • Page 14

    ... NXP Semiconductors 14. Revision history Table 9. Revision history Document ID Release date HEF4069UB_6 20091208 • Modifications: Section 8 “Recommended operating conditions” • Section 12 “Application information” Figure 13 “Test set-up” • Section 15 “Legal information” HEF4069UB_5 20090723 HEF4069UB_4 20080704 HEF4069UB_CNV_3 19950101 HEF4069UB_CNV_2 19950101 ...

  • Page 15

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 16

    ... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11.1 Transfer characteristics . . . . . . . . . . . . . . . . . . 7 12 Application information Package outline ...