NTD3055-094T4 ONSEMI [ON Semiconductor], NTD3055-094T4 Datasheet
NTD3055-094T4
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NTD3055-094T4 Summary of contents
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... A N−Channel MARKING DIAGRAMS 4 Drain 4 DPAK CASE 369C STYLE Drain Gate Source 4 Drain 4 DPAK−3 CASE 369D STYLE Gate Drain Source 55094 Device Code A = Assembly Location Y = Year W = Work Week ORDERING INFORMATION Publication Order Number: NTD3055−094/D ...
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... SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage ( Adc Reverse Recovery Time Reverse Recovery Stored Charge 300 ms, Duty Cycle 3. Pulse Test: Pulse Width 4. Switching characteristics are independent of operating junction temperatures. NTD3055−094 ( unless otherwise noted Vdc 7.0 Vdc 6.0 Adc ...
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... Figure 3. On−Resistance versus Gate−to−Source Voltage 1 1.6 1.4 1.2 1 0.8 0.6 −50 − 100 T , JUNCTION TEMPERATURE ( C) J Figure 5. On−Resistance Variation with Temperature NTD3055−094 100 3 GATE− ...
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... GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) NTD3055−094 POWER MOSFET SWITCHING The capacitance (C a voltage corresponding to the off−state condition when calculating t on−state when calculating t At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET ...
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... T )/(R ). qJC J(MAX Power MOSFET designated E−FET can be safely used in switching circuits with unclamped inductive loads. For NTD3055−094 100 d(off d(on ...
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... V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 0.00001 0.0001 I Figure 14. Diode Reverse Recovery Waveform NTD3055−094 SAFE OPERATING AREA 100 STARTING JUNCTION TEMPERATURE ( C) J Figure 12. Maximum Avalanche Energy versus ...
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... Device NTD3055−094 NTD3055−094G NTD3055−094−1 NTD3055−094−1G NTD3055−094T4 NTD3055−094T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD3055−094 Package DPAK DPAK (Pb− ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD3055−094 PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6 ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD3055−094 PACKAGE DIMENSIONS DPAK−3 CASE 369D−01 ISSUE B C NOTES SOLDERING FOOTPRINT* 6 ...
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... Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 10 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NTD3055−094/D ...