lc4371-11-m1 Ledtech Electronics Corp., lc4371-11-m1 Datasheet - Page 6

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lc4371-11-m1

Manufacturer Part Number
lc4371-11-m1
Description
Single Digit Display Led
Manufacturer
Ledtech Electronics Corp.
Datasheet
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip.
2. Setting a product by using tool such as a holder should be avoided.
3. The hole pitch of a circuit board must fit into the lead pitch of products.
4. When soldering, care the followings:
5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA,
6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion.
7. The following may damage products or LED chips: Attachment or contact of residual flux solvent
Precautions in Use:
PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO
DEVICE TO HIGH RELIABILITY
When bending is unavoidable, strictly follow the cautionary instruction below.
(1)Bend the leads before soldering.
(2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part.
(3) The lead bending point must be more than 1.6mm away from the edge or the resin part.
(4)When a pin is tested for its endurance, bending degree should be 45∘and repeated no more than two times.
When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance,
thermal expansion, thermal contraction of holder, product and circuit board etc.
(1)Do not heat a product under any stress (i.e.: twist) to leads.
(2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part.
(3 The lead bending point must be more than 1.6mm away from the edge or the resin part.
(4)Soldering with PC Board should be conducted with following conditions.
less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash
around the leads, instead of the entire LED, by the following conditions.
Cleaning agent : Methyl Alcohol
Cleaning temp : 45℃ Max.
Cleaning time : 30Sec. Max.
(a) For dip soldering
(b) Soldering iron : 350 ℃(Soldering iron tip) for within 3 Sec.
onto the product surface or to LED chips, or invasion of the same into the product.
Pre-heating : 90 ℃ Max. for within 60 Sec.
Soldering Max. : 260 ± 5 ℃ (Solder Temp.) for within 5 Sec.
LA(C)4371-11-M1
VER.: 01 Date: 2007/01/16
0.43" SINGLE DIGIT
DISPLAY
Page: 5/5

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