UPC1679G NEC, UPC1679G Datasheet - Page 9

• Manufacturer Part Number: UPC1679G
• Description: 5 V-BIAS/ +5.5 dBm OUTPUT/ 1.8 GHz WIDEBAND Si MMIC AMPLIFIER
• Manufacturer: NEC

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to V
(4) The inductor must be attached between V
(5) The DC cut capacitor must be attached to input pin.
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
accordance with desired frequency.
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Soldering Conditions
Data Sheet P12434EJ4V0DS00
CC
Note
Note
Note
and output pins. The inductance value should be determined in
CC
line.
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
–
PC1679G
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