UPC2776 NEC, UPC2776 Datasheet - Page 11

• Manufacturer Part Number: UPC2776
• Description: 5 V/ SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER
• Manufacturer: NEC

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
tions than the recommended conditions are to be consulted with our sales representatives.
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PC2776TB
Infrared ray reflow
VPS
Wave soldering
Pin part heating
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor (e.g. 1 000 pF) should be attached to V
(4) The inductor must be attached between V
(5) The DC cut capacitor must be each attached to the input and output pins.
This product should be soldered in the following recommended conditions. Other soldering methods and condi-
Note It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-
Soldering method
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
method).
Package peak temperature: 235 C, Hour: within 30 s.
(more than 210 C), Time: 3 times, Limited days: no.
Package peak temperature: 215 C, Hour: within 40 s.
(more than 200 C), Time: 3 times, Limited days: no.
Soldering tub temperature: less than 260 C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 C, Hour: within 3 s/pin.
Limited days: no.
Note
Soldering conditions
CC
and output pin (e.g. 100 nH)
Note
CC
pin.
Note
Note
Recommended condition symbol
WS60-00-1
VP15-00-3
IR35-00-3
PC2776TB
11