RJ80535 Intel, RJ80535 Datasheet - Page 42

• Manufacturer Part Number: RJ80535
• Description: Pentium M Processor
• Manufacturer: Intel

Package Mechanical Specifications and Pin Information
42
Table 18. Micro-FCPGA Package Dimensions
NOTE: Overall height with socket is based on design dimensions of the Micro-FCPGA package with no thermal
A
-
A1
A2
A3
B
D
E
D1
E1
F
G
e
K
K1
K3
-
N
Pdie
W
Symbol
solution attached. Values are based on design specifications and tolerances. This dimension is subject
to change based on socket design, OEM motherboard design or OEM SMT process.
Overall height, top of die to pack age seating plane
Overall height, top of die to PCB surfac e, including
socket (Refer to Note 1)
Pin length
Die height
Pin-s ide capacitor height
Pin diameter
Package substrate length
Package substrate width
Die length
Die width
To Package Substrate Center
Die Offset from Package Center
Pin pitch
Package edge keep-out
Package corner keep-out
Pin-s ide capacitor boundary
Pin tip radial true position
Pin count
Allowable pressure on the die for therm al solution
Package weight
Package Surface Flatness
Parameter
Intel
1.88
4.74
1.95
0.28
34.9
34.9
Min
-
-
®
<=0.254
10.56
1.133
0.286
Pentium
0.82
7.84
17.5
1.27
478
4.5
14
5
7
M ax
2.02
5.16
2.11
1.25
0.36
35.1
35.1
689
®
M Processor Datasheet
eac h
Unit
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
m m
kPa
m m
g