IC-554-1-MF YAMAICHI [Yamaichi Electronics Co., Ltd.], IC-554-1-MF Datasheet

IC-554-1-MF

Manufacturer Part Number

IC-554-1-MF

Description

Dual InlineMemoryModule (DIMM, 72 pins)

Manufacturer

YAMAICHI [Yamaichi Electronics Co., Ltd.]

Datasheet

1.IC-554-1-MF.pdf (1 pages)

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IC554 Series

Outline Socket Dimensions

Æ3.20

Specifications

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

Mating Cycles:

Pin Count:

Materials and Finish

Housing:

Contacts:

Plating:

Features

í Card thickness 1.00mm

+ 0.1

3.70 ±0.5

Polyetherimide (PEI), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

R 1.50

1.27x17=21.59 Ref

1.27 ±0.1

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

1.27x 35=44.45 ±0.2

1.27x35=44.45 ±0.2

89.00 ±0.2

80.00 ±0.4

98.00 ±0.4

80.00 Ref

59.89

55.90 Ref

54.00

Front

Back

1,000M min. at 500V DC

700V AC for 1 minute

30m max. at 10mA/20mV max.

–55°C to +170°C

10,000 insertions min.

72 contact pins

1.27x18=22.86 Ref

+ 0.1

+ 0.2

0.67

+ 0.1

Dual Inline Memory Module

w0.40 x t0.30

Recommended PC Board Layout

Matching Module Dimensions

Æ3.20

Thru hole

+ 0.1

(1.27x17=21.59)

2.00

7.62

Part Number

IC-554

Series No.

1 = 72 Pins

MF = Flanged

Unmarked = Not Flanged

0.635 ±0.05

1.27 ±0.05

1.27±0.05

(1.27x17=21.59)

1.27x35=44.45 ±0.05

1.27 ±0.3

(DIMM, 72 pins)

44.45 ±0.05

59.69

51.66

1.27x35=44.45 ±0.1

1.27x35=44.45 ±0.05

1.02 ±0.3

Front

Back

89.00 ±0.1

(Details)

(1.27x18=22.86)

72- 0.80

(1.27x18=22.86)

Top View from Socket

Æ1.80±0.05

+ 0.1

Test & Burn-In

1.00

+ 0.09

– 0.07

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