IC-589-1-MF YAMAICHI [Yamaichi Electronics Co., Ltd.], IC-589-1-MF Datasheet

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IC-589-1-MF

Manufacturer Part Number
IC-589-1-MF
Description
Dual InlineMemoryModule (DIMM, 184 pins)
Manufacturer
YAMAICHI [Yamaichi Electronics Co., Ltd.]
Datasheet
B-6
Outline Socket Dimensions
IC589 Series
Test & Burn-In
Specifications
Æ3.20 Thru hole
Materials and Finish
Housing:
Contacts:
Plating:
Features
í Card thickness 1.27mm
í For 184 contact pins with 1.27mm pitch
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Pin Count:
3.70 ±0.5
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
1.27x51=64.77 ±0.2
1.27 ±0.15
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
120.65 ±0.2
129.50
153.70 ±0.4
162.70 ±0.2
171.70 ±0.4
153.70 ref
128.00 ref
1,000M min. at 500V DC
700V AC for 1 minute
30m max. at 10mA/20mV max.
–55°C to +170°C
10,000 insertions minimum
184 contact pins
+ 0.2
0
W
1.27 ±0.15
6.35 ref.
W
Dual Inline Memory Module
1.27x39=49.53 ±0.2
W0.40 x t0.30
Recommended PC Board Layout
Matching Module Dimensions
Æ3.20
Thru hole
1.27±0.05
Part Number
+ 0.1
4.00
IC-589
Series No.
Design No.
0
MF = Flanged
Unmarked = Not Flanged
1.27x51=64.77 ±0.1
1.27x51=64.77 ±0.1
(DIMM, 184 pins)
-
120.65 ±0.1
162.70 ±0.1
120.65
133.35
6.35
1
(Details)
-
1.27x39=49.53 ±0.1
MF
1.80
6.35
1.27 ±0.05
1.27x39=49.53 ±0.1
Top View from Socket
Thru hole
184- 0.80
3.00
Æ
+ 0.1
0
1.27

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