HEF40175BTT NXP [NXP Semiconductors], HEF40175BTT Datasheet
HEF40175BTT
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HEF40175BTT Summary of contents
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... Type number Package Name HEF40175BP DIP16 HEF40175BT SO16 HEF40175BTT TSSOP16 DD Description plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 3.9 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm power supply range referenced another input ...
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NXP Semiconductors 5. Functional diagram Fig 1. Functional diagram CP MR Fig 2. Logic diagram HEF40175B Product data sheet ...
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NXP Semiconductors 6. Pinning information 6.1 Pinning HEF40175B 001aae570 Fig 3. Pin configuration SOT38-4 and SOT109-1 6.2 Pin description Table 2. Pin description ...
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NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage I I output clamping current OK I ...
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NXP Semiconductors 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions |I | < 1 μA V HIGH-level IH O input voltage ...
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NXP Semiconductors Table 7. Dynamic characteristics = 25 °C; for test circuit see amb Symbol Parameter Conditions t LOW to HIGH Qn; PLH propagation delay see MR to Qn; see ...
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NXP Semiconductors 12. Waveforms input input input PLH output ...
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NXP Semiconductors a. Input waveforms b. Test circuit Test and measurement data is given in Definitions test circuit: DUT = Device Under Test Termination resistance should be equal to output impedance Load capacitance including ...
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NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...
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NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 ...
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NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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NXP Semiconductors 14. Revision history Table 10. Revision history Document ID Release date HEF40175B v.7 20110503 • Modifications: HEF40175B v.6 20101214 HEF40175B v.5 20100105 HEF40175B v.4 20090813 HEF40175B_CNV v.3 19950101 HEF40175B_CNV v.2 19950101 HEF40175B Product data sheet Data sheet status ...
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NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales ...
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NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...