74LVC2G66DCV66 NXP [NXP Semiconductors], 74LVC2G66DCV66 Datasheet
74LVC2G66DCV66
Related parts for 74LVC2G66DCV66
74LVC2G66DCV66 Summary of contents
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Bilateral switch Rev. 5 — 16 June 2010 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals (nY and ...
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NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name −40 °C to +125 °C 74LVC2G66DP −40 °C to +125 °C 74LVC2G66DC −40 °C to +125 °C 74LVC2G66GT −40 °C to +125 °C 74LVC2G66GD −40 ...
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NXP Semiconductors Fig 3. Logic diagram (one switch) 6. Pinning information 6.1 Pinning 74LVC2G66 GND 4 001aaa529 Fig 4. Pin configuration SOT505-2 and SOT765-1 74LVC2G66 GND 4 Transparent ...
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NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT765-1, SOT996-2 and SOT833 GND Functional description [1] Table 4. Function ...
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NXP Semiconductors 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter V supply voltage CC V input voltage I V switch voltage SW T ambient temperature amb Δt/ΔV input transition rise and fall rate [1] To avoid sinking GND ...
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NXP Semiconductors Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions C input I capacitance C OFF-state S(OFF) capacitance C ON-state S(ON) capacitance [1] All typical values are ...
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NXP Semiconductors 10.2 ON resistance Table 8. ON resistance At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Symbol Parameter Conditions R ON resistance V = GND to V ON(peak) I (peak ...
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NXP Semiconductors 10.3 ON resistance test circuit and graphs GND Fig 10. Test circuit for measuring ON resistance ...
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NXP Semiconductors (Ω) 11 (1) 9 (2) ( 0.5 1.0 1.5 2.0 = 125 °C. (1) T amb = 85 °C. (2) T amb = 25 °C. (3) T amb = −40 °C. ...
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NXP Semiconductors 11. Dynamic characteristics Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t propagation delay nY; pd ...
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NXP Semiconductors Σ{(C ) × V × sum of the outputs. L S(ON 11.1 Waveforms and test circuit Measurement points are given in Logic levels: V ...
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NXP Semiconductors negative positive Test data is given in Table 11. Definitions for test circuit Load resistor Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance ...
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NXP Semiconductors 11.2 Additional dynamic characteristics Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T Symbol Parameter THD total harmonic distortion −3 dB frequency response f (−3dB) α isolation (OFF-state) ...
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NXP Semiconductors Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T Symbol Parameter V crosstalk voltage ct Xtalk crosstalk Q charge injection inj 74LVC2G66 Product data sheet …continued Conditions between ...
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NXP Semiconductors 11.3 Test circuits Test conditions 1. 1.4 V (p-p 2 (p-p 2.5 V (p-p ...
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NXP Semiconductors G Fig 23. Test circuit for measuring crosstalk voltage (between digital inputs and switch 600 Ω 20 log ( log Fig 24. Test ...
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NXP Semiconductors G a. Test circuit logic input (nE) b. Input and output pulse definitions = ΔV × inj O L ΔV = output voltage variation generator resistance. gen V = generator voltage. gen ...
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NXP Semiconductors 12. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions ...
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NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index DIMENSIONS (mm are the original dimensions) A UNIT ...
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NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) ...
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NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT A ...
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NXP Semiconductors XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal ...
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NXP Semiconductors 13. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor TTL Transistor-Transistor Logic HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model DUT Device Under Test 14. Revision history Table 14. Revision history Document ID Release ...
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NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales ...
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NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...