74LVC3G34DP NXP [NXP Semiconductors], 74LVC3G34DP Datasheet

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Triple buffer Rev. 05 — 5 October 2007 1. General description The 74LVC3G34 provides three buffers. The inputs can be driven from either 3 devices. This feature allows the use of this device as translator ...

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... Table 1. Ordering information Type number Package Temperature range Name 74LVC3G34DP +125 C 74LVC3G34DC +125 C 74LVC3G34GT +125 C 74LVC3G34GM +125 C 4. Marking Table 2. Marking codes Type number 74LVC3G34DP 74LVC3G34DC 74LVC3G34GT 74LVC3G34GM 5. Functional diagram 001aaa684 Fig 1 ...

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NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74LVC3G34 GND 4 Transparent top view Fig 5. Pin configuration SOT833-1 (XSON8) 6.2 Pin description Table 3. Pin ...

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NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System ...

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NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter +85 C amb V HIGH-level input voltage IH V LOW-level input ...

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NXP Semiconductors Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I power-off leakage current ...

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NXP Semiconductors C = output load capacitance in pF supply voltage number of inputs switching sum of outputs 12. AC waveforms V I ...

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NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions ...

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NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. ...

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NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A ...

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NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area ...

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NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID ...

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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...