74LVT16244BBQ NXP [NXP Semiconductors], 74LVT16244BBQ Datasheet

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... Type number Package Temperature range 74LVT16244BDL +85 C 74LVTH16244BDL 74LVT16244BDGG +85 C 74LVTH16244BDGG 74LVT16244BEV +85 C 74LVT16244BBQ +125 C 74LVTH16244BBQ Name Description SSOP48 plastic shrink small outline package; 48 leads; body width 7.5 mm TSSOP48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm VFBGA56 plastic very thin fi ...

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NXP Semiconductors 4. Functional diagram 1A0 1Y0 47 2 1A1 1Y1 46 3 1A2 1Y2 44 5 1A3 1Y3 43 6 1OE 1 2A0 2Y0 41 8 2A1 2Y1 40 9 2A2 2Y2 38 11 2A3 2Y3 37 12 2OE ...

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NXP Semiconductors 5. Pinning information 5.1 Pinning 74LVT16244B 74LVTH16244B 1OE 1 1Y0 2 3 1Y1 GND 4 1Y2 5 6 1Y3 2Y0 8 2Y1 9 10 GND 2Y2 11 2Y3 12 3Y0 13 14 3Y1 GND 15 ...

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NXP Semiconductors terminal 1 index area (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 5. Pin configuration SOT1025-1 (HUQFN60U) 5.2 Pin description ...

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NXP Semiconductors Table 2. Pin description …continued Symbol Pin SOT370-1 and SOT362-1 GND 4, 10, 15, 21, 28, 34, 39 18, 31 1A0 to 1A3 47, 46, 44, 43 2A0 to 2A3 41, 40, 38, ...

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NXP Semiconductors Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter P total power dissipation tot [1] The input and output negative voltage ...

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NXP Semiconductors 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter [ +85 C amb V input clamping voltage IK V HIGH-level ...

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NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I supply current CC I additional supply current CC C input capacitance I C output capacitance O [1] Typical ...

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NXP Semiconductors 11. Waveforms Measurements points are given in V and V are typical voltage output levels that occur with the output load Fig 6. Propagation delay input (nAn) to output (nYn) nOE input nYn output nYn output ...

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NXP Semiconductors Test data is given in Table Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance ...

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NXP Semiconductors 12. Package outline SSOP48: plastic shrink small outline package; 48 leads; body width 7 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

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NXP Semiconductors TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 1.05 mm ...

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NXP Semiconductors VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 0.65 mm ball A1 index area ball A1 1 index area ...

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NXP Semiconductors HUQFN60U: plastic thermal enhanced ultra thin quad flat package; no leads 60 terminals; UTLP based; body 0.55 mm terminal 1 index area A11 ...

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... The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type number 74LVT16244BBQ and 74LVTH16244BBQ (HUQFN60U package) 74LVT_LVTH16244B_5 20060321 74LVT16244B_4 20021031 ...

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NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...