MC74AC10DG ON Semiconductor, MC74AC10DG Datasheet

IC GATE NAND TRPL 3INPUT 14-SOIC

MC74AC10DG

Manufacturer Part Number
MC74AC10DG
Description
IC GATE NAND TRPL 3INPUT 14-SOIC
Manufacturer
ON Semiconductor
Series
74ACr
Datasheet

Specifications of MC74AC10DG

Logic Type
NAND Gate
Number Of Inputs
3
Number Of Circuits
3
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MC74AC10, MC74ACT10
Triple 3−Input NAND Gate
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 8
MAXIMUM RATINGS
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Sink/Source Current, per Pin
DC V
Storage Temperature
Figure 1. Pinout: 14−Lead Packages Conductors
Outputs Source/Sink 24 mA
′ACT10 Has TTL Compatible Inputs
Pb−Free Packages are Available
CC
or GND Current per Output Pin
V
14
1
CC
13
2
Rating
12
3
(Top View)
11
4
10
5
9
6
Symbol
V
V
GND
T
I
I
V
I
out
CC
CC
out
stg
in
8
7
in
V
V
−0.5 to
−0.5 to
−0.5 to
−65 to
CC
CC
Value
+150
+7.0
±20
±50
±50
+0.5
+0.5
1
Unit
mA
mA
mA
°C
V
V
V
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
14
14
1
ORDERING INFORMATION
14
14
http://onsemi.com
1
1
1
Publication Order Number:
CASE 948G
CASE 751A
SOEIAJ−14
TSSOP−14
DT SUFFIX
CASE 646
M SUFFIX
CASE 965
N SUFFIX
D SUFFIX
PDIP−14
SOIC−14
MC74AC10/D

Related parts for MC74AC10DG

MC74AC10DG Summary of contents

Page 1

MC74AC10, MC74ACT10 Triple 3−Input NAND Gate Features • Outputs Source/Sink 24 mA • ′ACT10 Has TTL Compatible Inputs • Pb−Free Packages are Available Figure 1. Pinout: 14−Lead Packages ...

Page 2

RECOMMENDED OPERATING CONDITIONS Symbol V Supply Voltage Input Voltage, Output Voltage (Ref. to GND) in out Input Rise and Fall Time (Note ′AC Devices except Schmitt Inputs Input Rise ...

Page 3

... AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter t Propagation Delay PLH t Propagation Delay PHL *Voltage Range 3 3.3 V ±0.3 V. Voltage Range 5 5.0 V ±0 CHARACTERISTICS Symbol Parameter V Minimum High Level IH Input Voltage V Maximum Low Level ...

Page 4

... AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter t Propagation Delay PLH t Propagation Delay PHL *Voltage Range 5 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter C Input Capacitance IN C Power Dissipation Capacitance PD 74ACT T = +25° (V) L Min ...

Page 5

... MC74AC10N AWLYYWWG MC74ACT10N AWLYYWWG ORDERING INFORMATION Device MC74AC10N MC74AC10NG MC74ACT10N MC74ACT10NG MC74AC10D MC74AC10DG MC74AC10DR2 MC74AC10DR2G MC74ACT10D MC74ACT10DR2 MC74ACT10DR2G MC74ACT10DTR2 MC74ACT10DTR2G MC74AC10M MC74ACT10MEL MC74ACT10MELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb− ...

Page 6

−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI ...

Page 7

... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...

Page 8

... S A −V− C 0.10 (0.004) −T− SEATING G D PLANE 14X 0.36 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE 0.25 (0.010) ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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