PCA9540BGD NXP [NXP Semiconductors], PCA9540BGD Datasheet
PCA9540BGD
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PCA9540BGD Summary of contents
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PCA9540B 2-channel I Rev. 04 — 3 September 2009 1. General description The PCA9540B is a 1-of-2 bidirectional translating multiplexer, controlled via the I The SCL/SDA upstream pair fans out to two SCx/SDx downstream pairs, or channels. Only one SCx/SDx ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information +85 C amb Type number Topside Package mark Name PCA9540BD PA9540B SO8 PCA9540BDP 9540B TSSOP8 PCA9540BGD 40B XSON8U 4. Block diagram SD0 SD1 SC0 SC1 SCL SDA Fig 1. PCA9540B_4 Product data sheet Description plastic small outline package ...
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... SD1 PCA9540BD SD0 4 5 SC0 002aae713 Pin configuration for SO8 SCL 1 SDA 2 PCA9540BGD SD0 4 Transparent top view Pin configuration for XSON8U Pin description Pin Description 1 serial clock line 2 serial data line 3 supply voltage 4 serial data 0 ...
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NXP Semiconductors 6. Functional description Refer to 6.1 Device addressing Following a START condition the bus master must output the address of the slave it is accessing. The address of the PCA9540B is shown in Fig 5. The last bit ...
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NXP Semiconductors Table 6.3 Power-on reset When power is applied reset condition until V and the PCA9540B registers and I states (all zeroes), causing all the channels to be deselected. ...
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NXP Semiconductors Figure 7, we see that V 3 lower so the PCA9540B supply voltage could be set to 3.3 V. Pull-up resistors can then be used to bring the bus voltages to their appropriate levels (see More ...
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NXP Semiconductors 7.3 System configuration A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ ...
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NXP Semiconductors 7.5 Bus transactions SDA START condition Fig 12. Write control register SDA START condition Fig 13. Read control register 8. Application design-in information Fig 14. Typical application PCA9540B_4 Product data sheet slave address ...
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NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to ground (V Symbol tot T stg ...
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NXP Semiconductors 10. Static characteristics Table 5. Static characteristics +85 C; unless otherwise specified. SS amb See Table 6 for Symbol ...
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NXP Semiconductors Table 6. Static characteristics +85 C; unless otherwise specified. SS amb See Table 5 for Symbol Parameter Supply V ...
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NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics Symbol Parameter t propagation delay PD f SCL clock frequency SCL t bus free time between a STOP and BUF START condition t hold time (repeated) START HD;STA condition t LOW ...
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NXP Semiconductors SDA t BUF t LOW SCL t HD;STA P S Fig 15. Definition of timing on the I PCA9540B_4 Product data sheet HD;DAT HIGH SU;DAT 2 C-bus Rev. 04 — 3 ...
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NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...
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NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT A ...
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NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction ...
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NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 10. Acronym CDM ESD HBM 2 I C-bus I/O ...
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NXP Semiconductors 15. Revision history Table 11. Revision history Document ID Release date PCA9540B_4 20090903 • Modifications: Added XSON8U package offering (affects information”, PCA9540B_3 20090528 PCA9540B_2 20040929 (9397 750 13731) PCA9540B_1 20040413 (9397 750 12918) PCA9540B_4 Product data sheet Data ...
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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...