XCR3512XL-10FG324C XILINX [Xilinx, Inc], XCR3512XL-10FG324C Datasheet

no-image

XCR3512XL-10FG324C

Manufacturer Part Number
XCR3512XL-10FG324C
Description
XCR3512XL: 512 Macrocell CPLD
Manufacturer
XILINX [Xilinx, Inc]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XCR3512XL-10FG324C
Manufacturer:
XILINX
Quantity:
12
Part Number:
XCR3512XL-10FG324C
Manufacturer:
XILINX
0
Part Number:
XCR3512XL-10FG324C
Manufacturer:
XILINX
Quantity:
1
Part Number:
XCR3512XL-10FG324C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Part Number:
XCR3512XL-10FG324C(ES)
Manufacturer:
XILINX
0
Part Number:
XCR3512XL-10FG324CES
Manufacturer:
XILINX
0
DS081 (v1.2) September 4, 2001
Features
Table 1: Typical I
DS081 (v1.2) September 4, 2001
Advance Product Specification
Frequency (MHz)
Typical I
Lowest power 512 macrocell CPLD
7.5 ns pin-to-pin logic delays
System frequencies up to 127 MHz
512 macrocells with 12,800 usable gates
Available in small footprint packages
-
-
-
Optimized for 3.3V systems
-
-
-
-
Advanced system features
-
-
-
-
-
-
-
-
Fast ISP programming times
Port Enable pin for additional I/O
2.7V to 3.6V supply voltage at industrial grade voltage
range
Programmable slew rate control per output
Security bit prevents unauthorized access
Refer to XPLA3 family data sheet (DS012) for
architecture description
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
208-pin PQFP (180 user I/O)
256-ball FBGA (212 user I/O)
324-ball FBGA (260 user I/O)
Ultra low power operation
5V tolerant I/O pins with 3.3V core supply
Advanced 0.35 micron five layer metal EEPROM
process
FZP™ CMOS design technology
In-system programming
Input registers
Predictable timing model
Up to 23 clocks available per function block
Excellent pin retention during design changes
Full IEEE Standard 1149.1 boundary-scan (JTAG)
Four global clocks
Eight product term control terms per function block
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
CC
(mA)
CC
vs. Frequency at V
TBD
0
R
TBD
1
CC
TBD
10
= 3.3V, 25 C
TBD
0
0
20
www.xilinx.com
1-800-255-7778
14
TBD
40
XCR3512XL: 512 Macrocell CPLD
Advance Product Specification
Description
The XCR3512XL is a 3.3V, 512 macrocell CPLD targeted at
power sensitive designs that require leading edge program-
mable logic solutions. A total of 32 function blocks provide
12,800 usable gates. Pin-to-pin propagation delays are
7.5 ns with a maximum system frequency of 127 MHz.
TotalCMOS™ Design Technique for
Fast Zero Power
Xilinx offers a TotalCMOS CPLD, both in process technol-
ogy and design technique. Xilinx employs a cascade of
CMOS gates to implement its sum of products instead of
the traditional sense amp approach. This CMOS gate imple-
mentation allows Xilinx to offer CPLDs that are both high
performance and low power, breaking the paradigm that to
have low power, you must have low performance. Refer to
Figure 1
XCR3512XL TotalCMOS CPLD (data taken with 32
up/down, loadable 16-bit counters at 3.3V, 25°C).
Figure 1: XCR3512XL Typical I
140
120
100
80
60
40
20
0
TBD
60
and
0
Table 1
20
TBD
80
40
showing the I
= 3.3V, 25 C
TBD
100
Frequency (MHz)
60
CC
80
TBD
120
CC
vs. Frequency at V
100
vs. Frequency of our
TBD
140
120
DS024_01_112700
140
CC
160
1

Related parts for XCR3512XL-10FG324C

XCR3512XL-10FG324C Summary of contents

Page 1

... Advance Product Specification 0 14 Description The XCR3512XL is a 3.3V, 512 macrocell CPLD targeted at power sensitive designs that require leading edge program- mable logic solutions. A total of 32 function blocks provide 12,800 usable gates. Pin-to-pin propagation delays are 7.5 ns with a maximum system frequency of 127 MHz. ...

Page 2

... XCR3512XL: 512 Macrocell CPLD DC Electrical Characteristics Over Recommended Operating Conditions Symbol Parameter (2) V Output High voltage OH V Output Low voltage OL I Input leakage current IL I I/O High-Z leakage current IH I Standby current CCSB (4,5) I Dynamic current CC (6) C Input pin capacitance IN C Clock input capacitance ...

Page 3

... Typical current draw during configuration 3.6V. 6. Output pF. L DS081 (v1.2) September 4, 2001 Advance Product Specification I (3.3V (2.7V) OH 0.5 1 1.5 2 2.5 Volts Figure 2: Typical I/V Curve for the XPLA3 Family -7 Min. (3) (6) www.xilinx.com 1-800-255-7778 XCR3512XL: 512 Macrocell CPLD I (3.3V 3.5 4 4.5 5 DS012_10_041901 -10 -12 Max. Min. Max. Min 5 ...

Page 4

... XCR3512XL: 512 Macrocell CPLD Internal Timing Parameters Symbol Parameter Buffer Delays T Input buffer delay IN T Fast input buffer delay FIN T Global clock buffer delay GCK T Output buffer delay OUT T Output buffer enable/disable delay EN Internal Register and Combinatorial Delays T Latch transparent delay ...

Page 5

... Note: For T POD Figure 3: AC Load Circuit +3.0V 0V Measurements All circuit delays are measured at the +1.5V level of inputs and outputs, unless otherwise specified. DS024_04_11800 PD2 www.xilinx.com 1-800-255-7778 XCR3512XL: 512 Macrocell CPLD Values 390 390 Open Closed Closed Open Closed Closed , ...

Page 6

... Table 3: XCR3512XL I/O Pins (Continued) Function Block FT256 FG324 2 212 260 FT256 FG324 3 C14 C21 3 D13 C20 3 - B22 3 A15 B21 ...

Page 7

... R Table 3: XCR3512XL I/O Pins (Continued) Function Block Macrocell PQ208 5 1 197 196 195 194 5 16 193 ...

Page 8

... Table 3: XCR3512XL I/O Pins (Continued) Function FT256 FG324 Block - - M13 Y21 11 P15 W20 12 L12 W21 12 N16 Y22 12 N13 AB21 12 R15 Y19 12 M12 ...

Page 9

... R Table 3: XCR3512XL I/O Pins (Continued) Function Block Macrocell PQ208 ( ...

Page 10

... Table 3: XCR3512XL I/O Pins (Continued) Function FT256 FG324 Block ...

Page 11

... R Table 3: XCR3512XL I/O Pins (Continued) Function Block Macrocell PQ208 139 138 23 1 173 175 ( 176 23 15 177 23 16 178 24 1 137 ...

Page 12

... Table 3: XCR3512XL I/O Pins (Continued) Function FT256 FG324 Block R3 AA4 ...

Page 13

... Notes: 1. JTAG pins. DS081 (v1.2) September 4, 2001 Advance Product Specification Table 4: XCR3512XL Global, JTAG, Port Enable, Power, and No Connect Pins FT256 FG324 Pin Type - - IN0 / CLK0 IN1 / CLK1 - - IN2 / CLK2 - - IN3 / CLK3 - - TCK - - TDI - - TDO ...

Page 14

... The following table shows the revision history for this document Date Version 04/11/01 1.0 Initial Xilinx release. 04/19/01 1.1 Updated Typical I/V curve, 09/04/01 1.2 Updated AC Electrical: added T temperature. 14 XCR3512XL -10 PQ 208 C Package 256-ball Fineline BGA Package 256 324 Plastic FBGA Plastic FBGA FT256 FG324 ...

Related keywords