MC68HC705P9CDW FREESCALE [Freescale Semiconductor, Inc], MC68HC705P9CDW Datasheet - Page 149

• Manufacturer Part Number: MC68HC705P9CDW
• Description: Microcontrollers
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

13.1 Contents
13.2 Introduction
13.3 28-Pin PDIP — Case #710
MC68HC705P9 — Rev. 4.0
MOTOROLA
Advance Information — MC68HC705P9
H
28
1
G
A
F
13.2
13.3
13.4
13.5
The MC68HC705P9 is available in the following packages:
•
•
•
Freescale Semiconductor, Inc.
For More Information On This Product,
Case 710 — Plastic dual in-line package (PDIP)
Case 733 — Ceramic dual in-line package (Cerdip)
Case 751F — Small outline integrated circuit (SOIC)
D
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
28-Pin PDIP — Case #710 . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
28-Pin Cerdip — Case #733. . . . . . . . . . . . . . . . . . . . . . . . . . 150
28-Pin SOIC — Case #751F . . . . . . . . . . . . . . . . . . . . . . . . . 150
15
14
SEATING
PLANE
Section 13. Mechanical Specifications
N
B
Go to: www.freescale.com
Mechanical Specifications
K
C
M
L
J
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
2. DIMENSION L TO CENTER OF LEADS
3. DIMENSION B DOES NOT INCLUDE
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
N
MILLIMETERS
36.45
13.72
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
15.24 BSC
0
2.54 BSC
37.21
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
1.02
15
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
0.100 BSC
0.600 BSC
0
INCHES
Technical Data
MAX
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
15
149