MC68HC708XL36 FREESCALE [Freescale Semiconductor, Inc], MC68HC708XL36 Datasheet - Page 350

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MC68HC708XL36

Manufacturer Part Number
MC68HC708XL36
Description
HCMOS Microcontroller Unit
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Specifications
MC68HC708XL36
350
SEATING
PLANE
–C–
C
L
–A–
E
H
49
64
DATUM
PLANE
–H–
48
1
0.20 (0.008)
0.20 (0.008)
0.05 (0.002)
–D–
G
DETAIL C
DETAIL C
Freescale Semiconductor, Inc.
M
Figure 6. Case Outline Drawing 963-02
M
A–B
A
S
L
W
For More Information On This Product,
H
C
DETAIL A
A–B
A–B
S
S
X
Go to: www.freescale.com
D
D
S
33
16
S
U
T
32
17
K
R
Specifications
–B–
–H–
Q
0.01 (0.004)
B
DATUM
PLANE
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DEFINE MAXIMUM
0.02 (0.008)
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –C–.
CERAMIC BODY DIMENSION INCLUDING GLASS
PROTRUSION AND MISMATCH BETWEEN
CERAMIC BODY AND COVER.
J
DIM
A
B
C
D
G
H
K
N
Q
R
U
W
E
F
J
L
P
S
T
V
X
VIEW ROTATED 90
SECTION B–B
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
3.00
0.30
2.54
0.30
0.45
0.13
0.65
0.13
0.13
0.13
0.35
CLOCKWISE
12.00 REF
0
0
0.80 BSC
0.40 BSC
1.60 REF
B
B
_
_
DETAIL A
M
14.10
14.10
17.45
17.45
MAX
F
D
C
0.45
3.22
0.40
0.89
0.23
0.95
0.17
0.30
0.45
4.11
–––
–––
7
_
A–B
0.547
0.547
0.012
0.100
0.012
0.018
0.005
0.026
0.005
0.005
0.667
0.005
0.667
0.014
0.118
MIN
0.031 BSC
0.472 REF
0.016 BSC
0
0
0.063 REF
_
S
INCHES
_
_
N
–A–, –B–, –D–
D
MAX
0.555
0.555
0.162
0.018
0.127
0.016
0.035
0.009
0.037
0.007
0.012
0.687
0.687
0.018
–––
–––
7
S
_
P
MOTOROLA
BASE METAL
18-spec_a

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