MC68HC711G5 MOTOROLA [Motorola, Inc], MC68HC711G5 Datasheet - Page 193

• Manufacturer Part Number: MC68HC711G5
• Description: High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcontroller
• Manufacturer: MOTOROLA [Motorola, Inc]

MC68HC11G5
14.3
C
(Note 1) 84
-L-
0.25 (0.010)
PACKAGE DIMENSIONS
-P-
Z
S
G1
T L S — M S N S — P S
G
-N-
DIM
1
G1
K1
Z1
W
A
B
C
E
G
G
H
K
R
U
V
X
Y
F
J
Z
MILLIMETERS
30.10
30.10
29.21
29.21
28.20
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
—
2
2
1.27 BSC
V
A
R
30.35
30.35
29.36
29.36
28.70
MAX
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
10
10
—
—
—
J
-M-
Y BRK
DETAIL S
E
0.18 (0.007)
0.18 (0.007)
W
1.185
1.185
0.165
0.090
0.013
0.026
0.020
0.025
1.150
1.150
0.042
0.042
0.042
1.110
0.040
MIN
0.050 BSC
—
2
2
-T- SEATING PLANE
INCHES
0.10 (0.004)
D
D
1.195
1.195
0.180
0.110
0.019
0.032
1.156
1.156
0.048
0.056
0.056
0.020
1.130
MAX
10
10
—
—
—
M T L S — M S N S — P S
M T L S — M S N S — P S
MECHANICAL DATA
NOTES:
1.
2.
3.
4.
5. DIMENSIONS AND TOLERANCING PER ANSI
6. CONTROLLING DIMENSION: INCH
B
Z1
DUE TO SPACE LIMITATION, CASE 780-01 SHALL BE
REPRESENTED BY A GENERAL CASE OUTLINE
DRAWING.
DATUMS -L-, -M-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT PLASTIC
BODY AT MOLD PARTING LINE.
DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM -T-, SEATING PLANE
DIM R AND U DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.25 (0.010) PER
SIDE
Y14.5M, 1982
0.18 (0.007)
K1
U
K
X
0.18 (0.007)
M T
DETAIL S
N S — P S
F
H
M T
0.18 (0.007)
0.18 (0.007)
0.18 (0.007)
0.18 (0.007)
N S — P S
0.25 (0.010)
G1
L S — M S
VIEW D-D
M T L S — M S
M T
M T L S — M S N S — P S
M T
M T
L S — M S
N S — P S
N S — P S
N S — P S
MOTOROLA
N S — P S
L S — M S
L S — M S
L S — M S
14-3