AT88SA100S-SH-CZ-T ATMEL [ATMEL Corporation], AT88SA100S-SH-CZ-T Datasheet - Page 21

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AT88SA100S-SH-CZ-T

Manufacturer Part Number
AT88SA100S-SH-CZ-T
Description
Atmel CryptoAuthentication Battery Authentication Chip
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
8X – TSSOP
Notes:
Package Drawing Contact:
packagedrawings@atmel.com
1. This drawing is for general information onl
2. Dimension D does not include mold Flash, protrusions or
3. Dimension E1 does not include inter-lead Flash or
4. Dimension b does not include Dambar protrusion.
5. Dimension D and E1 to be determined at Datum Plane H.
Top View
JEDEC Drawing MO-153, VariationAA, for proper
dimensions, tolerances, datums, etc.
gate burrs. Mold Flash, protrusions and gate burrs shall not
exceed 0.15mm (0.006in) per side.
protrusions. Inter-lead Flash and protrusions shall not exceed
0.25mm (0.010in) per side.
Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
Side View
Pin 1 indicator
this corner
D
b
e
1
N
A2
E1
A
A1
TITLE
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
E
y.
Refer to
End View
SYMBOL
C
Atmel AT88SA100S [DATASHEET]
A
A1
A2
D
E
E1
b
e
L
L1
C
0.05
0.80
2.90
4.30
0.19
0.45
COMMON DIMENSIONS
MIN
L
(Unit of Measure = mm)
-
L1
GPC
0.65 BSC
TNR
1.00 REF
NOM
1.00
3.00
4.40
0.60
0.09
-
-
DRAWING NO.
8558F−CRYPTO−9/11
6.40 BSC
MAX
1.20
0.15
1.05
3.10
4.50
0.30
0.75
-
8X
NOTE
0.20
2, 5
3, 5
4
6/22/11
REV.
D
21

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