W25X32 WINBOND [Winbond], W25X32 Datasheet
W25X32
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W25X32 Summary of contents
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... AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... STATUS REGISTER .................................................................................................... 12 11.1.1 BUSY............................................................................................................................12 11.1.2 Write Enable Latch (WEL) ............................................................................................12 11.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12 11.1.4 Top/Bottom Block Protect (TB) .....................................................................................12 11.1.5 Reserved Bits ...............................................................................................................12 11.1.6 Status Register Protect (SRP) ......................................................................................13 11.1.7 Status Register Memory Protection ..............................................................................14 11.2 INSTRUCTIONS........................................................................................................... 16 11.2.1 Manufacturer and Device Identification.........................................................................16 11.2.2 Instruction Set...............................................................................................................17 11.2.3 Write Ensable (06h)......................................................................................................18 W25X16, W25X32, W25X64 Table of Contents - 2 - ...
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... SOIC 208-mil (Package Code SS)...................................................................... 40 13.2 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41 13.3 8-contact 6x5 WSON .................................................................................................... 42 13.4 8-contact 6x5 WSON (Cont’d) ...................................................................................... 43 13.5 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44 14. ORDERING INFORMATION .................................................................................................... 45 15. REVISION HISTORY ................................................................................................................ 46 W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... GENERAL DESCRIPTION The W25X16 (16M-bit), W25X32 (32M-bit), and W25X64 (64M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µ ...
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... PIN CONFIGURATION SOIC 208-MIL Figure 1a. W25X16 and W25X32 Pin Assignments, 8-pin SOIC (Package Code SS) 4. PIN CONFIGURATION WSON 6X5-MM Figure 1b. W25X16 Pin Assignments, 8-pin WSON (Package Code ZP) W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... PIN CONFIGURATION PDIP 300-MIL Figure 1c. W25X16, W25X32, W25X64 Pin Assignments, 8-pin PDIP (Package Code DA) 6. PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM PAD NO. PAD NAME 1 / /WP 4 GND 5 DIO 6 CLK 7 /HOLD 8 VCC W25X16, W25X32, W25X64 I/O FUNCTION I Chip Select Input ...
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... PIN CONFIGURATION SOIC 300-MIL Figure 1d. W25X16, W25X32 and W25X64 Pin Assignments, 16-pin SOIC 300-mil (Package Code SF) 8. PIN DESCRIPTION SOIC 300-MIL PAD NO. PAD NAME 1 /HOLD 2 VCC 3 N/C 4 N/C 5 N/C 6 N /WP 10 GND 11 N/C 12 N/C 13 N/C 14 N/C 15 DIO 16 CLK W25X16, W25X32, W25X64 I/O FUNCTION I Hold Input ...
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... SOIC (package code SS). The W25X16 in 6x5-mm WSON (package code ZP) and 25X32 and 25X64 in 8x6-mm WSON. (package code ZE). The 25X16, W25X32 and W25X64 are offered in 16-pin plastic 300-mil width SOIC (package code SF) and 300- mil DIP (package code DA). See figures 1a-d. Package diagrams and dimensions are illustrated at the end of this datasheet ...
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... BLOCK DIAGRAM /WP /HOLD CLK /CS DIO DO Figure 2. W25X16, W25X32 and W25X64 Block Diagram W25X16, W25X32, W25X64 7FFF00h 7F0000h 40FF00h 400000h 3FFF00h 3F0000h 20FF00h 200000h 1FFF00h 1F0000h 00FF00h 000000h Publication Release Date February 26, 2007, Revision E 7FFFFFh 7F00FFh 40FFFFh 4000FFh 3FFFFFh 3F00FFh 20FFFFh 2000FFh ...
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... During a /HOLD condition, the Serial Data Output (DO) is high impedance, and Serial Data Input/Output (DIO) and Serial Clock (CLK) are ignored. The Chip Select (/CS) signal should be kept active (low) for the full duration of the /HOLD operation to avoid resetting the internal logic state of the device. W25X16, W25X32, W25X64 - 10 - ...
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... See Status Register for further information. Additionally, the Power-down instruction offers an extra level of write protection as all instructions are ignored except for the Release Power-down instruction. W25X16, W25X32, W25X64 , (See Power-up Timing and Voltage Levels and Figure 20). While WI time delay is reached. If needed a pull-up ...
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... Status register bit location S6 is reserved for future use. Current devices will read 0 for this bit location recommended to mask out the reserved bit when testing the Status Register. Doing this will ensure compatibility with future devices. W25X16, W25X32, W25X64 in AC characteristics). All, none or a portion of the memory W ...
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... When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is high the Write Status Register instruction is allowed. W25X16, W25X32, W25X64 Figure 3. Status Register Bit Locations - 13 - ...
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... W25X32 (32M-BIT) MEMORY PROTECTION ADDRESSES NONE NONE 63 3F0000h - 3FFFFFh 62 and 63 3E0000h - 3FFFFFh 3C0000h - 3FFFFFh 380000h - 3FFFFFh 300000h - 3FFFFFh 200000h - 3FFFFFh ...
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... Note don’t care W25X16, W25X32, W25X64 W25X16 (16M-BIT) MEMORY PROTECTION ADDRESSES NONE NONE 31 1F0000h - 1FFFFFh 1E0000h - 1FFFFFh 1C0000h - 1FFFFFh 180000h - 1FFFFFh 100000h - 1FFFFFh 0 000000h - 00FFFFh 0 and 1 000000h - 01FFFFh 0 thru 3 000000h - 03FFFFh ...
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... Status Register is being written, all instructions except for Read Status Register will be ignored until the program or erase cycle has completed. 11.2.1 Manufacturer and Device Identification MANUFACTURER ID Winbond Serial Flash Device ID Instruction W25X16 W25X32 W25X64 W25X16, W25X32, W25X64 (M7-M0) EFH (ID15-ID0) (ID7-ID0) 9Fh ABh, 90h 3015h 14h 3016h ...
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... DO pin. 2. The Status Register contents will repeat continuously until /CS terminates the instruction. 3. See Manufacturer and Device Identification table for Device ID information. 4. The Device ID will repeat continuously until /CS terminates the instruction. W25X16, W25X32, W25X64 BYTE 3 BYTE 4 BYTE 5 (1) A15– ...
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... DIO pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write Status Register, Page Program, Sector Erase, Block Erase and Chip Erase instructions. Figure 5. Write Disable Instruction Sequence Diagram W25X16, W25X32, W25X64 - 18 - ...
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... Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the cycle is complete and if the device can accept another instruction. The Status Register can be read continuously, as shown in Figure 6. The instruction is completed by driving /CS high. Figure 6. Read Status Register Instruction Sequence Diagram W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is high the Write Status Register instruction is allowed. Figure 7. Write Status Register Instruction Sequence Diagram W25X16, W25X32, W25X64 (See AC Characteristics). While ...
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... Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the current cycle. The Read Data instruction allows clock rates from D. maximum of f (see AC Electrical Characteristics). R Figure 8. Read Data Instruction Sequence Diagram W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... The dummy clocks allow the devices internal circuits additional time for setting up the initial address. During the dummy clocks the data value on the DIO pin is a “don’t care”. W25X16, W25X32, W25X64 (see AC Electrical Characteristics). This is accomplished by adding R Figure 9 ...
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... The input data during the dummy clocks is “don’t care”. However, the DIO pin should be high-impedance prior to the falling edge of the first data out clock. Figure 10. Fast Read Dual Output Instruction Sequence Diagram W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... After the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Page Program instruction will not be executed if the addressed page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 11. Page Program Instruction Sequence Diagram W25X16, W25X32, W25X64 - 24 - ...
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... Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector Erase instruction will not be executed if the addressed page is protected by the Block Protect (TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 12. Sector Erase Instruction Sequence Diagram W25X16, W25X32, W25X64 (See AC Characteristics). While the Sector SE Publication Release Date: ...
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... Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the addressed page is protected by the Block Protect (TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 13. Block Erase Instruction Sequence Diagram W25X16, W25X32, W25X64 (See AC Characteristics). While the Block ...
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... Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed if any page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 14. Chip Erase Instruction Sequence Diagram W25X16, W25X32, W25X64 (See AC Characteristics). While the Chip Erase cycle ...
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... Ignoring all but one instruction makes the Power Down state a useful condition for securing maximum write protection. The device always powers-up in the normal operation with the standby current of ICC1. Figure 15. Deep Power-down Instruction Sequence Diagram W25X16, W25X32, W25X64 (See AC Characteristics). While in the power-down state only the - 28 - ...
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... Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 17. The Device ID values for the W25X16, W25X32, AND W25X64 are listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction is completed by driving /CS high ...
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... Figure 17. Release Power-down / Device ID Instruction Sequence Diagram - 30 - W25X16, W25X32, W25X64 ...
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... Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 18. The Device ID values for the W25X16, W25X32, AND W25X64 are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID ...
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... JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 19. For memory type and capacity values refer to Manufacturer and Device Identification table. W25X16, W25X32, W25X64 Figure 19. Read JEDEC ...
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... Lead Temperature Electrostatic Discharge Voltage Notes: 1. Specifications for W25X32 and W25X64 are preliminary. See preliminary designation at the end of this datasheet. 2. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability ...
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... Data Retention Full Temperature Range 12.4 Power-up Timing and Write Inhibit Threshold PARAMETER VCC (min) to /CS Low Time Delay Before Write Instruction Write Inhibit Threshold Voltage Note: 1. These parameters are characterized only. W25X16, W25X32, W25X64 CONDITIONS SYMBOL t (1) VSL t (1) PUW V ...
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... Input High Voltage V IH Output Low Voltage V OL Output High Voltage V OH Notes: 1. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V. 2. Checker Board Pattern. W25X16, W25X32, W25X64 CONDITIONS MIN ( (2) OUT /CS = VCC, VIN = GND or VCC ...
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... Load Capacitance Load Capacitance for FR only 1 Input Rise and Fall Times Input Pulse Voltages Input Timing Reference Voltages Output Timing Reference Voltages Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. W25X16, W25X32, W25X64 SYMBOL ...
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... Not Active Hold Time relative to CLK Data In Setup Time Data In Hold Time /CS Active Hold Time relative to CLK /CS Not Active Setup Time relative to CLK /CS Deselect Time Output Disable Time Clock Low to Output Valid 2.7V-3.6V / 3.0V-3.6V Output Hold Time W25X16, W25X32, W25X64 SYMBOL ALT MIN (4) ...
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... Byte Program Time (First Byte) Additional Byte Program Time (After First Byte) Page Program Time Sector Erase Time (4KB) Block Erase Time (64KB) Chip Erase Time W25X16 Chip Erase Time W25X32 Chip Erase Time W25X64 Notes: 1. Clock high + Clock low must be less than or equal to 1/f 2. ...
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... Serial Output Timing 12.10 Input Timing 12.11 Hold Timing W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane. W25X16, W25X32, W25X64 INCHES MIN MAX 0 ...
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... Symbol α W25X16, W25X32, W25X64 Base Plane 1 Seating Plane 1 Dimension in inch Dimension in mm Min Nom Max Min Nom 0.175 0.010 0.25 0.125 0.130 0.135 3.18 3.30 0.016 0.018 0.022 0.41 0.46 0.060 1 ...
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... WSON W25X16, W25X32, W25X64 - 42 - ...
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... WSON Cont’d. W25X16, W25X32, W25X64 Publication Release Date February 26, 2007, Revision E ...
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... Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. W25X16, W25X32, W25X64 INCHES MIN MAX 0.093 0.104 0.004 0.012 ...
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... Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T), when placing orders. 1c. The “W” prefix is not included on the part marking. Valid Combinations for W25X16/32/64: W25X16VSSIG W25X16VSFIG W25X16VDAIG W25X16VZPIG W25X16, W25X32, W25X64 (1) W25X32VSSIG W25X32VSFIG W25X32VDAIG W25X32VZEIG - 45 - W25X64VSFIG ...
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... A 02/13/06 B 06/28/06 C 10/19/06 D 2/1/07 E 2/26/07 W25X16, W25X32, W25X64 PAGE New Create Added W25X64 in the product family of W25X16/32/64. Added 300mil PDIP package. Added 6x5 mm WSON package. Updated Endurance and Data Retention table (11.3), ICC’ Parameter table (11.5 & 11.6). 1-4, 6, 32-36, Reduced tPP (max) from 5mS to 3mS. 41, 42 Changed tSHCH from 5nS to 0nS. Added byte programming parameters (tBP1 & ...
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... FAX: 886-2-8751-3579 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners. W25X16, W25X32, W25X64 Winbond Electronics Corporation America 2727 North First Street, San Jose, CA 95134, U ...