VNN7NV04_10 STMICROELECTRONICS [STMicroelectronics], VNN7NV04_10 Datasheet

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VNN7NV04_10

Manufacturer Part Number
VNN7NV04_10
Description
OMNIFET II fully autoprotected Power MOSFET
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Features
Table 1.
September 2010
VND7NV04-1
VNN7NV04
VND7NV04
VNS7NV04
Linear current limitation
Thermal shutdown
Short circuit protection
Integrated clamp
Low current drawn from input pin
Diagnostic feedback through input pin
ESD protection
Direct access to the gate of the Power
MOSFET (analog driving)
Compatible with standard Power MOSFET in
compliance with the 2002/95/EC European
Directive
Package
SOT-223
TO-252
TO-251
Type
SO-8
Device summary
R
60 mΩ
DS(on)
VND7NV04-1
VNN7NV04
VNS7NV04
VND7NV04
Tube
I
6 A
lim
Tube (lead-free)
VND7NV04-1-E
VND7NV04-E
V
40 V
clamp
Doc ID 7383 Rev 3
-
-
fully autoprotected Power MOSFET
VND7NV04, VND7NV04-1
Order codes
Description
The VNN7NV04, VNS7NV04, VND7NV04
VND7NV04-1, are monolithic devices designed in
STMicroelectronics VIPower M0-3 Technology,
intended for replacement of standard Power
MOSFETs from DC up to 50 kHz applications.
Built in thermal shutdown, linear current limitation
and overvoltage clamp protect the chip in harsh
environments.
Fault feedback can be detected by monitoring the
voltage at the input pin.
VNN7NV04, VNS7NV04
VNN7NV0413TR
VND7NV0413TR
VNS7NV0413TR
Tape and reel
2
TO252 (DPAK)
SOT-223
-
1
1
2
3
3
Tape and reel (lead-free)
TO251 (IPAK)
VND7NV04TR-E
OMNIFET II
SO-8
-
-
-
1
2
3
www.st.com
1/37
1

Related parts for VNN7NV04_10

VNN7NV04_10 Summary of contents

Page 1

Features Type R DS(on) VNN7NV04 VNS7NV04 60 mΩ VND7NV04 VND7NV04-1 ■ Linear current limitation ■ Thermal shutdown ■ Short circuit protection ■ Integrated clamp ■ Low current drawn from input pin ■ Diagnostic feedback through input pin ■ ESD protection ...

Page 2

Contents Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Electrical ...

Page 3

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

List of figures List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 49. TO-252 (DPAK) package dimensions ...

Page 6

Block diagram and pin description 1 Block diagram and pin description Figure 1. Block diagram INPUT 1 Figure 2. Configuration diagram (top view) 1. For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1. 6/37 VNN7NV04, ...

Page 7

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 2 Electrical specifications Figure 3. Current and voltage conventions 2.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol V Drain-source voltage ( Input voltage IN I Input current IN R ...

Page 8

Electrical specifications 2.2 Thermal data Table 3. Thermal data Symbol Parameter R Thermal resistance junction-case max thj-case R Thermal resistance junction-lead max thj-lead R Thermal resistance junction-ambient max thj-amb 1. When mounted on a standard single-sided FR4 board with 0.5 ...

Page 9

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Table 4. Electrical characteristics (continued) Symbol Parameter Switching (T =25 °C, unless otherwise specified Turn-on delay time d(on) t Rise time r t Turn-off delay time d(off) t Fall time f t Turn-on delay ...

Page 10

Protection features 3 Protection features During normal operation, the input pin is electrically connected to the gate of the internal Power MOSFET through a low impedance path. The device then behaves like a standard Power MOSFET and can be used ...

Page 11

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 4. Switching time test circuit for resistive load Figure 5. Test circuit for diode recovery times 10% t d(on) V gen FAST OMNIFET DIODE S B 150Ω ...

Page 12

Protection features Figure 6. Unclamped inductive load test circuits R GEN Figure 8. Unclamped inductive waveforms 12/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 7. Input charge test circuit V IN Doc ID 7383 Rev 3 ...

Page 13

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 3.1 Electrical characteristics curves Figure 9. Derating curve Figure 11. Static drain-source on resistance vs input voltage (part 1/2) Rds(on) (mOhm) 120 110 100 3.5 ...

Page 14

Protection features Figure 15. Turn-on current slope (part 1/2) di/dt(A/us) 2.25 2 1.75 1.5 1.25 1 0.75 0.5 0.25 100 200 300 400 500 600 700 Rg(ohm) Figure 17. Transfer characteristics Idon( Vds=13. ...

Page 15

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 21. Turn-off drain source voltage slope (part 2/2) dv/dt(v/us) 300 250 200 150 100 50 0 200 400 600 100 300 500 Rg(ohm) Figure 23. Output characteristics ID( ...

Page 16

Protection features Figure 27. Normalized input threshold voltage vs temperature Vin(th) 1.15 1.1 1.05 1 0.95 0.9 0.85 0.8 0.75 0.7 -50 - T(ºC) Figure 29. Step response current limit Tdlim(us) 7 6.5 Rg=150ohm 6 5.5 ...

Page 17

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 3.2 SO-8 maximum demagnetization energy Figure 30. SO-8 maximum turn-off current versus load inductance I LMAX (A) 100 10 1 0.1 Legend A = Single Pulse Repetitive pulse ...

Page 18

Protection features 3.3 DPAK maximum demagnetization energy Figure 32. DPAK maximum turn-off current versus load inductance (A) 100 10 1 0.01 Legend A = Single Pulse Repetitive pulse Repetitive ...

Page 19

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 3.4 SOT-223 maximum demagnetization energy Figure 34. SOT-223 maximum turn-off current versus load inductance I LMAX (A) 100 10 1 0.01 Legend A = Single Pulse Repetitive pulse ...

Page 20

Package and PCB thermal data 4 Package and PCB thermal data 4.1 SO-8 thermal data Figure 36. SO-8 PC board Note: Layout condition of R thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.14 cm Figure 37. R thj-amb RTHj_amb (ºC/W) ...

Page 21

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 38. SO-8 thermal impedance junction ambient single pulse ZT H (°C /W) 1000 100 10 1 0.1 0.0001 0.001 Figure 39. Thermal fitting model of an OMNIFET II in SO-8 Equation 1 Pulse calculation formula ...

Page 22

Package and PCB thermal data Table 5. SO-8 thermal parameter (continued) Area/island (cm 4.2 SOT-223 thermal data Figure 40. SOT-223 PC board Note: Layout condition of R thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.11 cm Figure 41. R thj-amb ...

Page 23

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 42. SOT-223 thermal impedance junction ambient single pulse ZT H (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Figure 43. Thermal fitting model of an OMNIFET II in SOT-223 Tj Equation 2 Pulse calculation formula ...

Page 24

Package and PCB thermal data Table 6. SOT-223 thermal parameter (continued) Area/island (cm 4.3 DPAK thermal data Figure 44. DPAK PC board Note: Layout condition of R thickness=2 mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8 cm2). ...

Page 25

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Figure 46. DPAK thermal impedance junction ambient single pulse ZT H (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Figure 47. Thermal fitting model of an OMNIFET II in DPAK Tj Pd Equation 3 Pulse calculation ...

Page 26

Package and PCB thermal data Table 7. DPAK thermal parameter (continued) Area/island (cm 26/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 7383 Rev 3 Footprint 6 0.0006 ...

Page 27

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 5 Package and packing information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are ...

Page 28

Package and packing information Figure 48. TO-251 (IPAK) package dimensions 5.2 TO-252 (DPAK) mechanical data Table 9. TO-252 (DPAK) mechanical data Symbol 28/37 VNN7NV04, VNS7NV04, VND7NV04, ...

Page 29

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Table 9. TO-252 (DPAK) mechanical data (continued) Symbol Package Weight Figure 49. TO-252 (DPAK) package dimensions 5.3 SOT-223 mechanical data Table 10. SOT-223 mechanical data Symbol ...

Page 30

Package and packing information Table 10. SOT-223 mechanical data (continued) Symbol Figure 50. SOT-223 package dimensions 5.4 SO-8 mechanical data Table 11. SO-8 mechanical data Symbol 30/37 VNN7NV04, ...

Page 31

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Table 11. SO-8 mechanical data (continued) Symbol ( ( ccc 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions ...

Page 32

Package and packing information 5.5 SOT-223 packing information Figure 52. SOT-223 tape and reel shipment (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter ...

Page 33

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 5.6 SO-8 packing information Figure 53. SO-8 tube shipment (no suffix) Figure 54. SO-8 tape and reel shipment (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width ...

Page 34

Package and packing information 5.7 DPAK packing information Figure 55. DPAK footprint and tube shipment (no suffix Figure 56. DPAK tape and reel shipment (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. ...

Page 35

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 5.8 IPAK packing information Figure 57. IPAK tube shipment (no suffix Base Q.ty Bulk Q.ty Tube length (± 0. (± 0.1) All dimensions are in mm. Doc ID 7383 Rev ...

Page 36

Revision history 6 Revision history Table 12. Document revision history Date 01-Feb-2003 28-Apr-2009 10-Sep-2010 36/37 VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Revision 1 Initial Release Added Table 1: Device summary on page 1 Package and PCB thermal data on page 2 Updated ...

Page 37

VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services ...

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