VNN7NV04_10 STMICROELECTRONICS [STMicroelectronics], VNN7NV04_10 Datasheet - Page 24

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VNN7NV04_10

Manufacturer Part Number
VNN7NV04_10
Description
OMNIFET II fully autoprotected Power MOSFET
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package and PCB thermal data
4.3
Note:
24/37
Table 6.
DPAK thermal data
Figure 44. DPAK PC board
Layout condition of R
thickness=2 mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8 cm2).
Figure 45. R
RTH j_amb (ºC/W)
SOT-223 thermal parameter (continued)
thj-amb
Area/island (cm
90
80
70
60
50
40
30
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
C5 (W.s/°C)
C6 (W.s/°C)
0
th
vs PCB copper area in open box free air condition
and Z
th
Doc ID 7383 Rev 3
measurements (PCB FR4 area=60 mm x 60 mm, PCB
2
)
2
VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
PCB CU heatsink area (cm^2)
4
6
Footprint
9.00E-04
3.00E-02
1000
0.16
0.5
8
10
2
2

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