SA56004ATK NXP [NXP Semiconductors], SA56004ATK Datasheet

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SA56004ATK

Manufacturer Part Number
SA56004ATK
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1. General description
2. Features
The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital
temperature sensor with overtemperature alarms. The remote channel of the SA56004X
monitors a diode junction, such as a substrate PNP of a microprocessor or a diode
connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP). With factory trimming,
remote sensor accuracy of 1 C is achieved.
Undertemperature and overtemperature alert thresholds can be programmed to cause
the ALERT output to indicate when the on-chip or remote temperature is out of range. This
output may be used as a system interrupt or SMBus alert. The T_CRIT output is activated
when the on-chip or remote temperature measurement rises above the programmed
T_CRIT threshold register value. This output may be used to activate a cooling fan, send a
warning or trigger a system shutdown. To further enhance system reliability, the
SA56004X employs an SMBus time-out protocol. The SA56004X has a unique device
architecture.
The SA56004X is available in the SO8, TSSOP8 and HVSON8 packages. SA56004X has
8 factory-programmed device address options. The SA56004X is pin-compatible with the
LM86, MAX6657/8, and ADM1032.
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SA56004X
temperature sensor with overtemperature alarms
Rev. 05 — 22 May 2008
Accurately senses temperature of remote microprocessor thermal diodes or diode
connected transistors within 1 C
On-chip local temperature sensing within 2 C
Temperature range of 40 C to +125 C
11-bit, 0.125 C resolution
8 different device addresses are available for server applications. The SA56004ED
with marking code 56004E, and SA56004EDP with marking code 6004E are address
compatible with the National LM86, the MAX6657/8 and the ADM1032.
Offset registers available for adjusting the remote temperature accuracy
Programmable under/overtemperature alarms: ALERT and T_CRIT
SMBus 2.0 compatible interface, supports TIMEOUT
Operating voltage range: 3.0 V to 3.6 V
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SO8, TSSOP8 and HVSON8 packages
Programmable conversion rate (0.0625 Hz to 26 Hz)
Undervoltage lockout prevents erroneous temperature readings
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
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1 C accurate, SMBus-compatible, 8-pin, remote/local digital
C-bus Standard-mode and Fast-mode compatible
Product data sheet

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SA56004ATK Summary of contents

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SA56004X 1 C accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with overtemperature alarms Rev. 05 — 22 May 2008 1. General description The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital temperature sensor with overtemperature alarms. The remote ...

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... SA56004ETK SA56004FTK [1] There are 8 device slave address options, as described in 4.1 Ordering options Table 2. Type number SA56004AD SA56004ADP SA56004ATK SA56004BD SA56004BDP SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms 3 0.85 mm Table 2. Ordering options ...

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NXP Semiconductors Table 2. Type number SA56004CD SA56004CDP SA56004DD SA56004DDP SA56004ED SA56004EDP SA56004ETK SA56004FD SA56004FDP SA56004FTK SA56004GD SA56004GDP SA56004HD SA56004HDP [1] The device slave address is factory programmed in OTP device address register. [2] The SA56004ED/EDP/ETK has the bus address ...

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NXP Semiconductors 6. Pinning information 6.1 Pinning T_CRIT Fig 2. Fig 4. 6.2 Pin description Table 3. Symbol T_CRIT GND ALERT SDATA SCLK SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms ...

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NXP Semiconductors 7. Functional description Refer to 7.1 Serial bus interface The SA56004X should be connected to a compatible two-wire serial interface System Management Bus (SMBus slave device using the two device terminals SCLK and SDATA. The ALERT ...

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NXP Semiconductors Table 4. Register assignments Register Command byte name Read Write address address LTHB 00h n/a RTHB 01h n/a SR 02h n/a CON 03h 09h CR 04h 0Ah LHS 05h 0Bh LLS 06h 0Ch RHSHB 07h 0Dh RLSHB 08h ...

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NXP Semiconductors 8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB Conversion Rate register (CR) is set to 8h; the default value of about 16 conversions/s. 7.5 Starting conversion Upon POR, the RUN/STOP bit ...

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NXP Semiconductors Table 5. Temperature +125 C + +0.125 0.125 7.8 SA56004X SMBus registers 7.8.1 Command register The command register selects which register will be read or ...

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NXP Semiconductors Table 7. Bit 7.8.4 Status register (SR) The contents of the status register reflect condition status resulting from all activities: comparison between temperature measurements and temperature limits, the status of A/D conversion, and the hardware ...

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NXP Semiconductors 7.8.5 Conversion rate register (CR) The conversion rate register is used to store programmable conversion data, which defines the time interval between conversions in the standard free-running auto convert mode. Table 9 4 LSBs of the register are ...

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NXP Semiconductors Table 13. Byte Bit Value [1] POR default TH = 0Ah (10 C). 7.8.7 Programmable offset register (remote only) Table 14. RTOHB, RTOLB - Remote temperature offset registers Byte High byte (read/write address 11h) Bit ...

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NXP Semiconductors 7.9 Interruption logic and functional description 7.9.1 ALERT output The ALERT output is used to signal Alert interruptions from the device to the SMBus or other system interrupt handler and it is active LOW. Because this is an ...

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NXP Semiconductors remote temperature high limit Fig 5. The following events summarize the ALERT output interrupt mode of operation: Event A: Master senses ALERT output being active-LOW. Event B: Master reads the SA56004X Status register to determine what cause the ...

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NXP Semiconductors Status register, at address 02h, during the interrupt service routine and then reset the ALERT mask bit 7 in the Configuration register to logic 0 at the end of the interrupt service routine (see In order for the ...

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NXP Semiconductors Table 16. ALERT response bit 7 (MSB 7.9.2 T_CRIT output The T_CRIT output is LOW when any temperature reading is greater than the preset limit in the corresponding critical temperature setpoint ...

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NXP Semiconductors Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in the interrupt mode). 7.9.3 Fault Queue To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault Queue for ...

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NXP Semiconductors Event F: Three consecutive measurements have been made with the remote temperature below the RCS HIGH). Event G: The remote temp falls below the Remote LOW setpoint. Event H: Three consecutive measurements are made with the temp below ...

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NXP Semiconductors LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a value less than +127 C and the Alert Mask is disabled, then the ALERT output will be pulled LOW. Note that the OPEN ...

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NXP Semiconductors 1 2 SCLK a6 a5 SDATA S START 1 2 SCLK SDATA data to be written to register a. Write Byte format (to write a data byte to the device register SCLK ...

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NXP Semiconductors 7.10.1 Serial interface reset If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling the data line and transmitting on the data line, the SA56004X must be returned to a known state in the ...

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NXP Semiconductors 9. Limiting values Table 17. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V supply voltage DD voltage at SDATA, SCLK, ALERT, T_CRIT V voltage at ...

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NXP Semiconductors 10. Characteristics Table 18. Electrical characteristics +125 C; unless otherwise specified. DD amb Symbol Parameter T local temperature error ERRL T remote temperature error ERRR T ...

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NXP Semiconductors Table 19. SMBus interface characteristics +125 C; unless otherwise specified. DD amb These specifications are guaranteed by design and not tested in production. Symbol Parameter V ...

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NXP Semiconductors t LOW SCLK t HD;STA SDATA t BUF P S Fig 11. Timing measurements SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms HIGH t HD;DAT SU;STA t SU;DAT Rev. 05 ...

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NXP Semiconductors 11. Performance curves 5 3.6 V shutdown 3 3 Fig 12. Typical I shutdown versus temperature and DD V ...

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NXP Semiconductors 5 3.6 V (mA) 3 Fig 16. Typical T_CRIT I versus temperature and 0 ...

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NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

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NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...

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NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the ...

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NXP Semiconductors 13. Packing information The SA56004X is packed in reels, as shown in guard band barcode label Fig 23. Tape and reel packing method 14. Soldering of SMD packages This text provides a very brief insight into a complex ...

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NXP Semiconductors Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm ...

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NXP Semiconductors Table 21. Package thickness (mm) < 1.6 1.6 to 2.5 > 2.5 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, ...

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NXP Semiconductors 2. Route the D+ and D lines parallel and close together with ground guards enclosing them (see 3. Leakage currents due to printed-circuit board contamination must be considered. Error can be introduced by these leakage currents. 4. Use ...

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NXP Semiconductors 17. Revision history Table 23. Revision history Document ID Release date SA56004X_5 20080522 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have ...

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NXP Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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